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SN74LVC1G125DBVT

Texas Instruments

SN74LVC1G125DBVT by Texas Instruments

SN74LVC1G125DBVT by Texas Instruments is a 3.3V bus driver with 4.7ns propagation delay, suitable for automotive applications. It features a 50pF load capacitance, 32A max I (ol), and operates in the temperature range of -40 to 125°C. This CMOS technology device has a small outline package style and is surface mountable.

Median Price

$0.744

Lifecycle Status

Suppliers In-Stock

31

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1k+

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Chip1Stop

Japan . 177 parts In-Stock

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Arrow

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Texas Instruments

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Farnell

UK . 825 parts In-Stock

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Element14

Singapore . 825 parts In-Stock

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Verical

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TEDSS.com

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Digiode

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Nova Conductors

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DF Sales Co.

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Chip Stock

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Bristol Electronics

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Sensible Micro Corp

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Cyclops Electronics Ltd

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QIE Inc.

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Prism Electronics

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ComSIT Distribution GmbH

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M&R Communications

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Microfarads

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Speed Components Ltd

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Semi Source

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Connector Distribution Corp

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Right Parts Inc.

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Mil-Aero Solutions, Inc.

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Netsource Technology, Inc.

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LWI Electronics Inc

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Semicontronic

India . 22,491 parts In-Stock

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Ampacity Inc.

Singapore . 22,223 parts In-Stock

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Corphita

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Argo Parts USA

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Netroflash

USA . 50 parts In-Stock

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Microchip USA

USA . 4,349 parts In-Stock

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Andel Nordic

Denmark . 3,216 parts In-Stock

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Parana Technologies

USA . 1,355 parts In-Stock

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DigiPath Technology Company

USA . 2,133 parts In-Stock

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ChromeModa Solutions

Germany . 4,548 parts In-Stock

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IDEA Electronic Components Group

UK . 623 parts In-Stock

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Corohmni

South Africa . 104 parts In-Stock

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Modulus Dynamics

Lithuania . 715 parts In-Stock

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Advanced Electronics

New Zealand . 87 parts In-Stock

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Lixinc

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Infinite Electronics LLP (Excess)

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Robosynatics

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Lucentia Tech

USA . 1,500 parts In-Stock

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Continental Prestige Electronics

USA . 571 parts In-Stock

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Futuretech Components

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Overview

Enhance your electronic designs with the SN74LVC1G125DBVT by Texas Instruments, a top-of-the-line Bus Driver & Transceiver that delivers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product offers a fast propagation delay of 4.7 ns and a wide operating temperature range of -40 to 125°C, making it ideal for a variety of applications. With a compact design and low power consumption, this versatile component provides exceptional value and performance, ensuring seamless operation in your projects. Elevate your circuits with the SN74LVC1G125DBVT and experience the superior benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures efficient and fast data transmission in bus applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and stable supply voltage of 3.3V, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception in bus driver applications.

Maximum I (ol): 32 Amp

High output current capability allows for driving heavy loads without performance degradation.

Output Characteristics: 3-STATE

3-STATE output provides flexibility in controlling the bus driver's output signal, allowing for effective communication protocols.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in harsh environmental conditions, suitable for automotive and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving efficiency and reliability of the product.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current requirements help in reducing energy consumption and heat generation, ideal for battery-operated devices.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DBVT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G125DBVT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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