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SN74LVC1G125DCKR

Texas Instruments

SN74LVC1G125DCKR by Texas Instruments

SN74LVC1G125DCKR by Texas Instruments is a 3-STATE bus driver with 4.7 ns propagation delay, suitable for automotive applications. It operates at a supply voltage of 1.8V to 5.5V, has a load capacitance of 50 pF, and features dual terminal position with small outline packaging.

Median Price

$0.072

Lifecycle Status

Suppliers In-Stock

59

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 547,524 parts In-Stock

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$0.072

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$0.049

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$0.072

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DigiKey

USA . 115,764 parts In-Stock

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$0.100

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$0.051

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$0.041

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$0.036

115,764

$0.100

$0.051

$0.041

$0.036

Arrow

USA . 4,475 parts In-Stock

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$0.329

100+ parts

$0.144

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$0.064

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$0.050

4,475

$0.329

$0.144

$0.064

$0.050

Chip1Stop

Japan . 6,000 parts In-Stock

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$0.038

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Verical

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RS (Exports)

UK . 700 parts In-Stock

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Rochester

USA . 213 parts In-Stock

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$0.042

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Distributors (In-Stock)

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Digiode

USA . 3,281 parts In-Stock

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Nova Conductors

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TME

Poland . 1,019 parts In-Stock

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Maritex

Poland . 14 parts In-Stock

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14

$0.186

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DF Sales Co.

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Component Electronics Inc.

Canada . 3,780 parts In-Stock

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Vyrian

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Semicontronic

India . 107,640 parts In-Stock

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Ampacity Inc.

Singapore . 113,806 parts In-Stock

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Corphita

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Netroflash

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Modulus Dynamics

Lithuania . 2,708 parts In-Stock

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Corohmni

South Africa . 508 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 165 parts In-Stock

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$6.137

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$5.951

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Andel Nordic

Denmark . 1,593 parts In-Stock

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Parana Technologies

USA . 1,003 parts In-Stock

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$29.204

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$2,712.077

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DigiPath Technology Company

USA . 401 parts In-Stock

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Germany . 5,144 parts In-Stock

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UK . 997 parts In-Stock

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Overview

Enhance your circuit designs with the SN74LVC1G125DCKR by Texas Instruments, a high-quality bus driver and transceiver that offers superior performance and reliability. With Texas Instruments' renowned reputation for innovation and precision engineering, this product ensures seamless data transmission in various applications. From automotive to industrial settings, the SN74LVC1G125DCKR provides exceptional value with its fast propagation delay, low power consumption, and versatile features. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 4.7 ns

With a low propagation delay, this bus driver & transceiver offers fast signal transmission, making it ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes installation of this product easy and efficient, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V allows for efficient power consumption, making this product suitable for energy-efficient systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable signal transmission, reducing the risk of signal distortion or loss.

Output Characteristics: 3-STATE

The 3-state output characteristics allow the bus driver & transceiver to control the bus signals effectively, enabling flexibility in signal routing and management.

Temperature Grade: AUTOMOTIVE

With automotive-grade temperature specifications, this product is suitable for use in automotive applications where temperature fluctuations are common, ensuring reliable performance in harsh environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable for various digital communication systems.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCKR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCKR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-618-4952, 5962016184952

NIIN

016184952

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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