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74LVC1G126GW,165

NXP Semiconductors

74LVC1G126GW,165 by NXP Semiconductors

NXP Semiconductors' 74LVC1G126GW,165 is a CMOS bus driver with 6ns propagation delay and 24A max I (ol). It operates at -40 to 125 °C, suitable for automotive applications. The small outline package has a rectangular shape, 0.65mm terminal pitch, and enables high control type.

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6

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1k+

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Chip Stock

USA . 143,000 parts In-Stock

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One Stop Electronics

USA . 1,226 parts In-Stock

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Ampacity Inc.

Singapore . 376 parts In-Stock

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AZTECH Wire

Italy . 747 parts In-Stock

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Corohmni

South Africa . 543 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,010 parts In-Stock

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Semicontronic

India . 1,165 parts In-Stock

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Overview

Enhance your electronic designs with the 74LVC1G126GW,165 by NXP Semiconductors. This high-quality bus driver and transceiver offers fast propagation delay at a nominal supply voltage of 1.8V, making it ideal for automotive applications. With a small outline package and true output polarity, this component ensures efficient performance and seamless integration. Trust NXP Semiconductors for innovative solutions that deliver reliability and value to your projects. Upgrade your systems with the 74LVC1G126GW,165 and experience superior functionality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transceiver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay allows for fast signal transmission, making this transceiver suitable for high-speed communication applications.

Surface Mount: YES

Surface mount design allows for easy installation and saves space on the PCB, making it more compact and efficient.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement enables energy-efficient operation and compatibility with a wide range of systems.

Output Characteristics: 3-STATE

3-STATE output allows for multiple devices to share the same bus, reducing the number of required transceivers in a system.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliable performance in harsh environmental conditions, making it suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this transceiver efficient and reliable in operation.

Technical Specifications

Bus Driver & Transceivers 74LVC1G126GW,165 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G126GW,165 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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