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SN74LVC4245APWE4

Texas Instruments

SN74LVC4245APWE4 by Texas Instruments

Texas Instruments SN74LVC4245APWE4 is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 3.3V, translating b/w 3V and 5V signals with a propagation delay of 6.7 ns. Ideal for bidirectional applications in industrial settings due to its compact size and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,004 parts In-Stock

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4,004

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Digiode

USA . 323 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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Parana Technologies

USA . 1,396 parts In-Stock

1+ parts

$7.898

100+ parts

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$8.453

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1,396

$7.898

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$8.453

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Ampacity Inc.

Singapore . 1,303 parts In-Stock

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$8.000

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$8.000

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ChromeModa Solutions

Germany . 4,865 parts In-Stock

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$8.874

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$7.277

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$8.874

$7.277

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IDEA Electronic Components Group

UK . 1,012 parts In-Stock

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$8.874

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$8.430

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$7.987

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$8.874

$8.430

$7.987

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Andel Nordic

Denmark . 3,008 parts In-Stock

1+ parts

$8.890

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$8.535

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$8.535

3,008

$8.890

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$8.535

$8.535

AZTECH Wire

Italy . 237 parts In-Stock

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$9.571

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Corohmni

South Africa . 142 parts In-Stock

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$9.925

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Advanced Electronics

New Zealand . 20 parts In-Stock

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$14.310

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$13.594

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$13.594

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20

$14.310

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$13.594

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Semicontronic

India . 1,615 parts In-Stock

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$33.000

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$32.175

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$32.010

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$33.000

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$32.010

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One Stop Electronics

USA . 595 parts In-Stock

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$44.000

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Continental Prestige Electronics

USA . 4,205 parts In-Stock

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Argo Parts USA

USA . 2,508 parts In-Stock

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Corphita

USA . 2,498 parts In-Stock

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DigiPath Technology Company

USA . 974 parts In-Stock

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$8.001

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974

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$8.001

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Bastille Electronics

Australia . 52 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC4245APWE4 by Texas Instruments, a top-tier manufacturer known for quality and reliability. As a leading product in the Bus Driver & Transceivers category, this versatile component offers seamless voltage translation between 3V and 5V systems, providing unmatched efficiency and performance. With a compact package style and impressive output characteristics, this innovative solution ensures smooth data transmission across a variety of applications. Elevate your projects with the exceptional value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and cost-effective solution for the product.

Propagation Delay At Nominal Supply: 6.7 ns

Low propagation delay allows for fast signal transmission and processing.

Surface Mount: YES

Allows for easy assembly and integration into various circuits.

Package Shape: RECTANGULAR

Compact shape ensures efficient use of space on a circuit board.

No. of Bits: 8

Supports communication between multiple devices with high data resolution.

Translation: 3V & 5V

Compatible with a wide range of voltage levels for versatile use.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage ensures reliable operation of the product.

Power Supplies (V): 3.3

Matches the nominal supply voltage for consistent performance.

No. of Terminals: 24

Sufficient terminals for connectivity and signal transmission.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design for space-constrained applications.

Maximum I (ol): 24 Amp

High output current capability for driving bus lines effectively.

Propagation Delay (tpd): 6.7 ns

Minimal delay ensures prompt data transmission.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Output Characteristics: 3-STATE

Allows for tristate outputs, improving signal integrity on the bus.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and corrosion-resistant terminal finish.

Terminal Position: DUAL

Dual positioning for flexibility in circuit layout and connection.

No. of Ports: 2

Supports connection to multiple devices simultaneously.

Maximum Seated Height: 1.2 mm

Low profile design for space-saving installation.

Width: 4.4 mm

Compact width for efficient board space utilization.

Output Polarity: TRUE

Provides a clear and accurate output signal.

Minimum Supply Voltage (Vsup): 2.7 V

Supports operation at lower supply voltage levels.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for reliable solder joints.

Length: 7.8 mm

Compact length for easy integration into circuit designs.

Temperature Grade: INDUSTRIAL

Designed for reliable operation in industrial environments.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals for secure and reliable connections.

Packing Method: TUBE

Convenient packaging for easy handling and storage.

Terminal Pitch: 0.65 mm

Fine pitch terminals for high-density mounting.

Count Direction: BIDIRECTIONAL

Supports bidirectional data transmission for versatile use.

Control Type: COMMON CONTROL

Allows for centralized control of multiple devices.

Maximum Supply Voltage (Vsup): 3.6 V

Safely operates within specified voltage limits for prolonged product life.

Technical Specifications

Bus Driver & Transceivers SN74LVC4245APWE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

5V SUPPLY FOR PORT A; 3.3V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

4.4 mm

Trade Compliance

SN74LVC4245APWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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