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74LVC1T45GF,132

NXP Semiconductors

74LVC1T45GF,132 by NXP Semiconductors

NXP Semiconductors' 74LVC1T45GF,132 is a bus driver with translation capabilities b/w 1.8V and 5V. It features a max I (ol) of 24A, propagation delay of 23.5ns, and operates in automotive-grade temperatures (-40 to 125°C). This device is ideal for bidirectional control applications requiring common control with small outline packaging.

Median Price

$0.163

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$0.163

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10

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Chip Stock

USA . 144,000 parts In-Stock

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144,000

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VNN

France . 33,391 parts In-Stock

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Vyrian

USA . 4,056 parts In-Stock

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Digiode

USA . 2,913 parts In-Stock

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Anansix

USA . 1,234 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,510 parts In-Stock

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$0.163

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$0.160

6,510

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$0.160

Argo Parts USA

USA . 1,498 parts In-Stock

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$0.163

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$0.158

1,498

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$0.158

AZTECH Wire

Italy . 12,059 parts In-Stock

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$5.362

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$5.362

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Ampacity Inc.

Singapore . 712 parts In-Stock

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$9.000

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712

$9.000

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Semicontronic

India . 177 parts In-Stock

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$15.000

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$14.625

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$14.550

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177

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Corohmni

South Africa . 384 parts In-Stock

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$16.199

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384

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$29.695

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$28.210

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$28.210

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$28.210

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One Stop Electronics

USA . 1,328 parts In-Stock

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$31.000

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Aztec Data Supply Inc.

USA . 311 parts In-Stock

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$31.630

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311

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Component Stockers USA

USA . 525 parts In-Stock

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$99.990

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Perfect Parts

USA . 7,571 parts In-Stock

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Corphita

USA . 3,422 parts In-Stock

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Supply Digital

USA . 2,255 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.160

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$0.155

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$0.152

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Microchip USA

USA . 278 parts In-Stock

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UNI Independent Distributors

Spain . 158 parts In-Stock

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Overview

Unlock seamless communication with the NXP Semiconductors 74LVC1T45GF,132 Bus Driver & Transceivers. This high-quality product offers reliable translation from 1.8V to 5V, catering to various applications such as automotive systems and industrial equipment. With a maximum operating temperature of 125°C and a compact design, this device ensures optimal performance in any environment. Experience the value of efficient data transmission and enhanced connectivity with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a low supply voltage helps to reduce power consumption and heat generation.

Propagation Delay (tpd): 23.5 ns

Fast propagation delay ensures quick signal transmission, ideal for high-speed data applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for harsh environments.

Output Characteristics: 3-STATE

3-state output allows for high-impedance output state, providing flexibility in bus system design.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliable performance in automotive environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels.

Technical Specifications

Bus Driver & Transceivers 74LVC1T45GF,132 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

23.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.8/5V&1.8/5V

Width:

1 mm

Trade Compliance

74LVC1T45GF,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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