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SN74LVC2G126DCTR

Texas Instruments

SN74LVC2G126DCTR by Texas Instruments

SN74LVC2G126DCTR by Texas Instruments is a 2-function bus driver with a propagation delay of 4 ns at 1.8V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and surface mount packaging.

Median Price

$0.452

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Mouser Electronics

USA . 1,396 parts In-Stock

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Rochester

USA . 344,998 parts In-Stock

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DigiKey

USA . 344,998 parts In-Stock

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Verical

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Arrow

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Chip1Stop

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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Maritex

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DigiKey Marketplace

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North Shore Components

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Micros

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Partservice

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Micros sp.j. W. Kędra i J. Lic

Poland . 1,020 parts In-Stock

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Speed Components Ltd

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Semicontronic

India . 105,848 parts In-Stock

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Ampacity Inc.

Singapore . 105,532 parts In-Stock

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Corphita

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Component Stockers USA

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Corohmni

South Africa . 673 parts In-Stock

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Continental Prestige Electronics

USA . 6,563 parts In-Stock

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Argo Parts USA

USA . 408 parts In-Stock

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Advanced Electronics

New Zealand . 10 parts In-Stock

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Microchip USA

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Parana Technologies

USA . 77 parts In-Stock

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DigiPath Technology Company

USA . 1,810 parts In-Stock

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Germany . 6,740 parts In-Stock

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IDEA Electronic Components Group

UK . 35 parts In-Stock

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Andel Nordic

Denmark . 2,841 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance and reliability with the SN74LVC2G126DCTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in every product. This bus driver & transceiver is versatile, making it ideal for a wide range of applications. From data communication to automotive systems, this innovative device offers exceptional value, benefits, and advantages to customers looking for seamless operation and efficiency in their projects. Trust Texas Instruments to deliver excellence with the SN74LVC2G126DCTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for transportation applications.

Propagation Delay At Nominal Supply: 4 ns

With a fast propagation delay, this product ensures efficient signal transmission in bus driver applications.

Surface Mount: YES

Being surface mountable makes this product easy to install and saves space on the PCB.

No. of Functions: 2

Having two functions in one device offers added functionality and versatility in circuit design.

Nominal Supply Voltage / Vsup: 1.8 V

Operating at a low supply voltage, this product helps conserve power in bus driver applications.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product is optimized for driving capacitive loads in bus systems.

Power Supplies (V): 3.3

The availability of multiple power supplies at 3.3V ensures compatibility with various system requirements.

No. of Terminals: 8

Having 8 terminals provides ample connection points for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

This compact package style saves board space and allows for dense PCB layouts.

Maximum I (ol): 32 Amp

With a high maximum output current of 32 Amps, this product can drive heavy loads with ease.

Propagation Delay (tpd): 9.8 ns

The low propagation delay of 9.8 ns ensures fast signal transmission and responsiveness in bus driver applications.

Maximum Operating Temperature: 125 °C

Operating at a high temperature range of up to 125°C, this product is suitable for automotive and industrial environments.

Output Characteristics: 3-STATE

The 3-state output allows for tristate output control, providing flexibility in bus communication systems.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures down to -40°C, making it suitable for harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish offers excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in PCB layout and integration.

No. of Ports: 2

Having 2 ports allows for multiple signal routing options, enhancing the versatility of the product.

Maximum Seated Height: 1.3 mm

The low seated height of 1.3 mm enables compact and slim designs in space-constrained applications.

Width: 2.8 mm

With a narrow width of 2.8 mm, this product saves space on the PCB for efficient layout design.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 1.65 V

Designed to operate at a minimum supply voltage of 1.65V, making it suitable for low-power applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes for reliable assembly.

Length: 2.95 mm

The compact length of 2.95 mm further contributes to space-saving and efficient PCB layout designs.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature handling makes this product suitable for use in automotive electronics applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, ideal for reliable operation in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical connection and simplifies assembly processes.

Packing Method: TR

The tape and reel packing method ensures easy handling, storage, and automated assembly processes.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on the PCB, saving valuable board space.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies system design and enhances compatibility with standard bus protocols.

Control Type: ENABLE HIGH

With an enable high control type, this product offers straightforward and efficient control logic integration.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this product offers compatibility with a wide range of system requirements.

Maximum Power Supply Current (ICC): 0.01 mA

With a low maximum power supply current of 0.01 mA, this product helps minimize power consumption in the system.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G126DCTR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

2.8 mm

Trade Compliance

SN74LVC2G126DCTR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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