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74LVC1G125SE-7

Diodes Incorporated

74LVC1G125SE-7 by Diodes Incorporated

74LVC1G125SE-7 by Diodes Inc. is a CMOS bus driver & transceiver with a propagation delay of 6 ns and load capacitance of 50 pF. It is used in automotive applications, has a small outline package style, and operates at temperatures ranging from -40 to 125 °C.

Median Price

$0.093

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 12,000 parts In-Stock

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$0.100

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$0.044

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$0.035

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$0.031

12,000

$0.100

$0.044

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$0.031

Mouser Electronics

USA . 6,826 parts In-Stock

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$0.120

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$0.053

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$0.043

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Newark

USA . 129 parts In-Stock

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$0.298

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$0.097

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$0.058

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129

$0.298

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Verical

USA . 621,000 parts In-Stock

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$0.028

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Arrow

USA . 432,000 parts In-Stock

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Element14

Singapore . 3,715 parts In-Stock

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$0.093

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$0.049

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$0.041

3,715

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Farnell

UK . 2,550 parts In-Stock

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$0.070

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$0.047

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2,550

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.069

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10

$0.069

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IBS Electronics

USA . 327,000 parts In-Stock

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Vyrian

USA . 300,340 parts In-Stock

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Chip Stock

USA . 48,565 parts In-Stock

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NAC Semi

USA . 12,000 parts In-Stock

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Sensible Micro Corp

USA . 4,601 parts In-Stock

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4,601

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VNN

France . 3,264 parts In-Stock

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Tectiva GmbH

Germany . 2,575 parts In-Stock

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Bristol Electronics

USA . 1,858 parts In-Stock

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$0.150

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$0.045

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Electronic Treasures

USA . 1,720 parts In-Stock

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Halfin

Belgium . 1,383 parts In-Stock

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Atlantic Semiconductor

USA . 600 parts In-Stock

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600

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Prism Electronics

USA . 31 parts In-Stock

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31

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Semtec, LLC

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Distributors (Availability)

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Ampacity Inc.

Singapore . 300,316 parts In-Stock

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$0.019

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Semicontronic

India . 335,849 parts In-Stock

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Argo Parts USA

USA . 4,664 parts In-Stock

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$0.069

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$0.067

4,664

$0.069

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$0.067

Continental Prestige Electronics

USA . 2,151 parts In-Stock

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$0.170

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$0.068

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$0.033

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$0.025

2,151

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$0.068

$0.033

$0.025

Corohmni

South Africa . 722 parts In-Stock

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$9.989

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Andel Nordic

Denmark . 4,422 parts In-Stock

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$10.713

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$10.285

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$10.285

Aztec Data Supply Inc.

USA . 3,521 parts In-Stock

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$22.310

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$30.773

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$28.003

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$25.234

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Perfect Parts

USA . 420,374 parts In-Stock

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RC Electronics

USA . 180,000 parts In-Stock

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 24,000 parts In-Stock

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Lixinc

USA . 14,194 parts In-Stock

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Infinite Electronics LLP (Excess)

. 9,654 parts In-Stock

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Robosynatics

Brazil . 1,520 parts In-Stock

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Lucentia Tech

USA . 1,520 parts In-Stock

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$21.094

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$20.664

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$20.664

Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 174 parts In-Stock

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Overview

Discover the 74LVC1G125SE-7 by Diodes Incorporated, a top-quality bus driver & transceiver that offers unmatched performance and reliability. With Diodes Incorporated's proven track record of excellence, you can trust that this product is built to last. Designed for a wide range of applications, this compact and efficient device delivers seamless data transmission with a minimal propagation delay of just 6 ns. Its true value lies in its ability to enhance the functionality of your systems while providing maximum convenience and ease of use. Upgrade your projects today with the 74LVC1G125SE-7 and experience the advantages it brings to your designs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6 ns

Provides fast signal transmission, ensuring quick and efficient communication between devices.

Surface Mount: YES

Easy installation and space-saving design, making it convenient for compact electronic devices.

No. of Functions: 1

Simplifies the setup and operation process by offering a single integrated function.

No. of Bits: 1

Supports binary data transmission, allowing for precise and accurate information exchange.

Nominal Supply Voltage / Vsup (V): 3.3

Works efficiently with a common and widely available supply voltage, reducing the need for additional components.

Load Capacitance (CL): 50 pF

Can handle a significant load capacitance, ensuring stability and reliability in various applications.

Power Supplies (V): 3.3

Compatible with standard power supplies, eliminating the need for specialized equipment or modifications.

No. of Terminals: 5

Simple and straightforward connection process, reducing complexity during installation.

Maximum I (ol): 24 Amp

Capable of handling high current outputs, ensuring robust and powerful performance.

Propagation Delay (tpd): 10.5 ns

Minimizes signal delays, enabling real-time data transmission and minimizing latency.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, making it suitable for use in challenging environments.

Output Characteristics: 3-STATE

Offers the ability to disconnect the output, providing flexibility and allowing multiple devices to share a bus without interference.

Minimum Operating Temperature: -40 °C

Performs reliably even in extremely cold conditions, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Provides corrosion resistance and improves solderability, ensuring long-lasting and reliable connections.

No. of Ports: 2

Allows simultaneous communication with multiple devices, enhancing efficiency and versatility.

Maximum Seated Height: 1.1 mm

Compact design, allowing for integration into slim and space-constrained electronic devices.

Width: 1.25 mm

Small form factor, enabling easy integration in various applications without occupying excess space.

Output Polarity: TRUE

Ensures accurate and consistent output polarity, preventing compatibility issues and errors in data interpretation.

Minimum Supply Voltage (Vsup): 1.65 V

Operates efficiently even with low supply voltage levels, making it suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands high-temperature soldering processes, ensuring reliability during manufacturing.

Peak Reflow Temperature °C: 260

Resistant to high-temperature environments, maintaining performance and durability under extreme conditions.

Length: 2 mm

Compact size, facilitating integration in small-scale electronic devices without sacrificing functionality.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity, enhancing energy efficiency and minimizing signal interference.

Terminal Form: GULL WING

Simplifies the soldering process and provides secure electrical connections, ensuring stable operation.

Packing Method: TR

Convenient packaging that eases transportation, storage, and handling during manufacturing and distribution processes.

Terminal Pitch: 0.65 mm

Allows for precise and compact terminal placement, maximizing space utilization on the circuit board.

Control Type: ENABLE LOW

Enables easy control and operation with a simple enable/disable mechanism, improving user experience.

Moisture Sensitivity Level (MSL): 1

Resists moisture damage, ensuring long-term reliability and performance in various environments.

Maximum Supply Voltage (Vsup): 5.5 V

Able to handle higher supply voltages, offering flexibility and compatibility with diverse power sources.

Package Body Material: PLASTIC/EPOXY

Durable construction material, providing resistance against physical damage and enhancing the product's lifespan.

Package Shape: RECTANGULAR

Versatile shape that allows for easy integration into different electronic devices, maximizing compatibility and usability.

Temperature Grade: AUTOMOTIVE

Designed to withstand harsh automotive environments, ensuring reliability and performance in demanding conditions.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125SE-7 attributes and parameters. Explore more Bus Driver & Transceivers devices from Diodes Incorporated

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G125SE-7 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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