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SN74LVC1G125DCKJ

Texas Instruments

SN74LVC1G125DCKJ by Texas Instruments

SN74LVC1G125DCKJ by Texas Instruments is a 3.3V bus driver with 4.7ns propagation delay, suitable for automotive applications. It features a 50pF load capacitance, 32A max I (ol), and operates in temperatures ranging from -40 to 125°C. Ideal for compact designs requiring fast signal transmission.

Median Price

$0.084

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$0.084

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-

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870

$0.084

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Vyrian

USA . 4,932 parts In-Stock

1+ parts

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4,932

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Digiode

USA . 2,663 parts In-Stock

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2,663

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,199 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

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10k+ parts

$0.082

4,199

$0.084

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-

$0.082

Argo Parts USA

USA . 1,467 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

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10k+ parts

$0.081

1,467

$0.084

-

-

$0.081

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

$0.080

10k+ parts

$0.078

1,000

$0.084

-

$0.080

$0.078

Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$0.093

100+ parts

$0.092

1k+ parts

$0.090

10k+ parts

-

450

$0.093

$0.092

$0.090

-

Microchip USA

USA . 12,251 parts In-Stock

1+ parts

$0.815

100+ parts

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12,251

$0.815

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Andel Nordic

Denmark . 2,555 parts In-Stock

1+ parts

$8.372

100+ parts

-

1k+ parts

$8.037

10k+ parts

$8.037

2,555

$8.372

-

$8.037

$8.037

AZTECH Wire

Italy . 486 parts In-Stock

1+ parts

$18.075

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486

$18.075

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Parana Technologies

USA . 659 parts In-Stock

1+ parts

$18.250

100+ parts

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$18.383

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659

$18.250

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$18.383

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One Stop Electronics

USA . 1,196 parts In-Stock

1+ parts

$20.000

100+ parts

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1,196

$20.000

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ChromeModa Solutions

Germany . 3,972 parts In-Stock

1+ parts

$20.506

100+ parts

$16.815

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3,972

$20.506

$16.815

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IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$20.506

100+ parts

$19.481

1k+ parts

$18.455

10k+ parts

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2,020

$20.506

$19.481

$18.455

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Corohmni

South Africa . 59 parts In-Stock

1+ parts

$29.067

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59

$29.067

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$30.263

100+ parts

$28.750

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$28.750

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5,000

$30.263

$28.750

$28.750

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Ampacity Inc.

Singapore . 1,577 parts In-Stock

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$31.000

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1,577

$31.000

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Semicontronic

India . 1,601 parts In-Stock

1+ parts

$48.000

100+ parts

$46.800

1k+ parts

$46.560

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1,601

$48.000

$46.800

$46.560

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iodParts Technologies Inc.

India . 201,000 parts In-Stock

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Corphita

USA . 4,442 parts In-Stock

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4,442

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DigiPath Technology Company

USA . 509 parts In-Stock

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$18.488

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509

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$18.488

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

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100+ parts

$73.663

1k+ parts

$73.663

10k+ parts

$73.663

250

-

$73.663

$73.663

$73.663

Overview

Elevate your electronic designs with the SN74LVC1G125DCKJ by Texas Instruments, a high-quality bus driver & transceiver that offers unparalleled performance and reliability. Manufactured by the renowned Texas Instruments, this compact device is perfect for a wide range of applications. With its fast propagation delay and low power consumption, this product delivers exceptional value to customers looking for efficient and cost-effective solutions. Upgrade your projects with the SN74LVC1G125DCKJ and experience the difference Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for high-performance applications.

Propagation Delay At Nominal Supply: 4.7 ns

With a low propagation delay, this bus driver ensures fast and efficient signal transmission in high-speed circuits.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility and compatibility with standard PCB layouts, making integration into existing designs seamless.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V, this bus driver provides reliable performance while minimizing power consumption.

Load Capacitance (CL): 50 pF

This product is designed to handle a load capacitance of 50 pF, ensuring stable and reliable signal transmission in various circuit environments.

Power Supplies (V): 3.3

With support for 3.3V power supplies, this bus driver is compatible with a wide range of electronic devices and systems.

No. of Terminals: 5

Featuring 5 terminals, this bus driver offers flexibility in connection options and supports multiple signal pathways for enhanced functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style makes this bus driver space-saving, ideal for compact designs and densely populated PCBs.

Maximum I (ol): 32 Amp

With a maximum output current of 32 Amp, this bus driver can drive high current loads with ease, making it suitable for demanding applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCKJ attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCKJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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