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M74VHC1GT125DT1G

Onsemi

M74VHC1GT125DT1G by Onsemi

M74VHC1GT125DT1G by Onsemi is a 1-bit bus driver & transceiver with a supply voltage of 3.3V, load capacitance of 50pF, and max operating temperature of 125°C. It is commonly used in military applications due to its small size (1.5mm width) and CMOS technology.

Median Price

$0.077

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 23,097 parts In-Stock

1+ parts

$0.500

100+ parts

$0.170

1k+ parts

$0.113

10k+ parts

$0.083

23,097

$0.500

$0.170

$0.113

$0.083

Mouser Electronics

USA . 92,767 parts In-Stock

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$0.080

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Rochester

USA . 78,101 parts In-Stock

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$0.087

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$0.072

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$0.065

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$0.087

$0.072

$0.065

EBV Elektronik

Germany . 42,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 18,636 parts In-Stock

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Arrow

USA . 6,000 parts In-Stock

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Verical

USA . 6,000 parts In-Stock

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RS (Exports)

UK . 5,100 parts In-Stock

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Chip1Stop

Japan . 2,700 parts In-Stock

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$0.074

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$0.061

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$0.058

2,700

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$0.074

$0.061

$0.058

Distributors (In-Stock)

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Digiode

USA . 88 parts In-Stock

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$0.067

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$0.067

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Nova Conductors

Japan . 150 parts In-Stock

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$0.110

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$0.110

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Component Electronics Inc.

Canada . 2,306 parts In-Stock

1+ parts

$0.770

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$0.580

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$0.500

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2,306

$0.770

$0.580

$0.500

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American Microsemiconductor Inc.

USA . 2,900 parts In-Stock

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$0.990

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$0.990

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Chip Stock

USA . 95,830 parts In-Stock

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Vyrian

USA . 52,322 parts In-Stock

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Flip Electronics

USA . 18,636 parts In-Stock

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Martec Srl

Italy . 2,986 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,593 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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TME

Poland . 1,290 parts In-Stock

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$0.138

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$0.097

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Microfarads

USA . 907 parts In-Stock

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ComSIT Distribution GmbH

Germany . 747 parts In-Stock

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Prism Electronics

USA . 406 parts In-Stock

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Semtec, LLC

USA . 248 parts In-Stock

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Bristol Electronics

USA . 215 parts In-Stock

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$0.375

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$0.225

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215

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$0.375

$0.225

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Bas Electronics GmbH & Co. KG

Germany . 156 parts In-Stock

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Elcom Components

USA . 85 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 52,314 parts In-Stock

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$0.054

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Semicontronic

India . 51,189 parts In-Stock

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$0.054

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$0.053

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$0.052

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51,189

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Corphita

USA . 235 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Argo Parts USA

USA . 555 parts In-Stock

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$0.110

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$0.106

555

$0.110

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$0.106

Bastille Electronics

Australia . 50 parts In-Stock

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$0.110

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$0.104

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$0.099

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$0.098

50

$0.110

$0.104

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$0.098

Microchip USA

USA . 2,676 parts In-Stock

1+ parts

$0.639

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2,676

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Aztec Data Supply Inc.

USA . 2,794 parts In-Stock

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$9.200

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$9.200

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$28.758

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$26.170

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$23.582

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$28.758

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$23.582

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Perfect Parts

USA . 956,222 parts In-Stock

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Continental Prestige Electronics

USA . 181,418 parts In-Stock

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$0.086

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RC Electronics

USA . 97,874 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Lixinc

USA . 13,717 parts In-Stock

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Assy Fe

Spain . 13,288 parts In-Stock

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TANS Electronics

Latvia . 6,900 parts In-Stock

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Kepictronics

USA . 6,840 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,834 parts In-Stock

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Problanco Electronics

Mexico . 2,497 parts In-Stock

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SupplyDigital Components

Austria . 2,403 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,889 parts In-Stock

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Kulean Microsystems

USA . 315 parts In-Stock

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Allen Electronics Distributors

USA . 200 parts In-Stock

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$0.146

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$0.100

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$0.062

200

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$0.146

$0.100

$0.062

UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Discover the M74VHC1GT125DT1G by Onsemi, a high-quality bus driver and transceiver that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is designed with precision and expertise. With its compact size and versatile functionality, it is perfect for a wide range of applications. Whether you need to drive buses or transmit data, this product delivers outstanding results. Experience the value and benefits of the M74VHC1GT125DT1G, from its true output polarity to its low power supply current. Trust Onsemi for all your bus driver and transceiver needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the product, making it suitable for various environments and conditions.

Surface Mount:

YES - The surface mount feature allows for easy installation and integration into circuitry, saving time and effort.

No. of Functions:

1 - This product has a single function, making it straightforward and efficient for its intended purpose.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy placement and arrangement within a circuit or system.

No. of Bits:

1 - With a single bit, this product provides simplicity and compatibility with systems that only require basic data transmission.

Nominal Supply Voltage / Vsup (V):

3.3 - The nominal supply voltage of 3.3V ensures compatibility with a wide range of devices and power sources.

Load Capacitance (CL):

50 pF - This load capacitance ensures optimal performance and signal integrity, enhancing the efficiency of data transmission.

Power Supplies (V):

3.3/5 - The availability of both 3.3V and 5V power supplies increases versatility and compatibility with various systems and environments.

No. of Terminals:

5 - With five terminals, this product offers convenient connectivity options and supports efficient data transfer.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This package style provides a compact and space-saving design, allowing for easy integration and installation in tight spaces.

Maximum I (ol):

80 Amp - The high maximum output current of 80 Amp enables the product to handle heavy loads effectively, ensuring reliable performance.

Propagation Delay (tpd):

16 ns - With a low propagation delay, this product ensures fast and efficient data transmission, reducing latency in the system.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature allows the product to function reliably even in elevated temperature environments.

Output Characteristics:

3-STATE - The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for efficient management of data transmission.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature ensures the product's reliability and functionality even in extreme cold conditions.

Terminal Finish:

Matte Tin (Sn) - annealed - The matte tin finish provides a durable and corrosion-resistant surface, increasing the product's lifespan and reliability.

Terminal Position:

DUAL - The dual terminal position offers flexibility in connection and installation, allowing for different wiring configurations.

No. of Ports:

2 - With two ports, this product enables connection and data transfer between multiple devices or systems.

Maximum Seated Height:

1.1 mm - The compact maximum seated height facilitates easy integration and installation in confined spaces.

Width:

1.5 mm - The compact width of 1.5 mm allows for efficient use of space within circuits or systems.

Output Polarity:

TRUE - The true output polarity ensures accurate and reliable signal transmission, minimizing the risk of errors or malfunction.

Minimum Supply Voltage (Vsup):

3 V - The minimum supply voltage of 3V allows for compatibility with lower power systems or devices.

Maximum Time At Peak Reflow Temperature (s):

40 - This product can withstand peak reflow temperature for up to 40 seconds, allowing for efficient soldering and assembly processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature of 260°C ensures reliable soldering and assembly, maintaining the structural integrity of the product.

Length:

3 mm - The compact length of 3 mm allows for efficient utilization of space in circuitry and system layouts.

Temperature Grade:

MILITARY - Designed to meet military-grade standards, this product offers enhanced durability, reliability, and performance.

Technology:

CMOS - The CMOS technology employed in this product ensures low power consumption, high-speed operation, and compatibility with a wide range of devices.

Terminal Form:

GULL WING - The gull wing terminal form provides secure and reliable connections, minimizing the risk of signal loss or disconnection.

Packing Method:

TR - The TR packing method ensures safe and organized storage, transportation, and distribution of the product.

Terminal Pitch:

0.95 mm - The small terminal pitch of 0.95 mm allows for compact design and efficient use of space within circuits or systems.

Count Direction:

UNIDIRECTIONAL - The unidirectional count direction ensures clear and consistent data transmission, minimizing confusion or errors in communication.

Control Type:

ENABLE LOW - The enable low control type provides flexibility in managing and controlling the product's output signal, allowing for efficient data transmission.

Moisture Sensitivity Level (MSL):

1 - With a moisture sensitivity level of 1, this product is highly resistant to moisture and can withstand prolonged exposure without affecting its functionality.

Maximum Supply Voltage (Vsup):

5.5 V - The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources and devices.

Maximum Power Supply Current (ICC):

50 mA - With a maximum power supply current of 50 mA, this product efficiently utilizes power resources while maintaining optimal performance.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT125DT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.5 mm

Trade Compliance

M74VHC1GT125DT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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