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M74VHC1G125DFT1G-L22038

Onsemi

M74VHC1G125DFT1G-L22038 by Onsemi

M74VHC1G125DFT1G-L22038 by Onsemi is a 3-STATE bus driver with 5 terminals, operating at a supply voltage range of 2V to 5.5V. It features a max I (ol) of 80A, propagation delay of 18ns, and load capacitance of 50pF. Ideal for applications requiring true output polarity control in compact designs with limited space constraints.

Median Price

$0.060

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$0.060

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Vyrian

USA . 6,513 parts In-Stock

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Digiode

USA . 499 parts In-Stock

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499

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Distributors (Availability)

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Corohmni

South Africa . 215 parts In-Stock

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$0.058

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Argo Parts USA

USA . 2,668 parts In-Stock

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$0.060

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2,668

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Continental Prestige Electronics

USA . 2,563 parts In-Stock

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$0.060

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Microchip USA

USA . 10,426 parts In-Stock

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$0.314

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$0.314

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AZTECH Wire

Italy . 753 parts In-Stock

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$6.096

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Aztec Data Supply Inc.

USA . 220 parts In-Stock

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$21.640

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Ampacity Inc.

Singapore . 1,457 parts In-Stock

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$28.000

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Semicontronic

India . 1,259 parts In-Stock

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$59.000

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$57.525

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$57.230

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Problanco Electronics

Mexico . 7,367 parts In-Stock

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SupplyDigital Components

Austria . 5,462 parts In-Stock

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Kulean Microsystems

USA . 3,145 parts In-Stock

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Corphita

USA . 1,738 parts In-Stock

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UHIMA Technologies

Türkiye . 989 parts In-Stock

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TANS Electronics

Latvia . 545 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$0.059

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$0.057

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$0.056

50

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$0.059

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$0.056

Overview

Enhance your electronic projects with the M74VHC1G125DFT1G-L22038 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Bus Driver & Transceivers that excel in performance and reliability. Whether you're working on automotive systems, consumer electronics, or industrial applications, this product offers unmatched value with its 3-STATE output characteristics, low propagation delay, and wide operating temperature range. Trust Onsemi for cutting-edge technology and innovative solutions to elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving time and space.

Nominal Supply Voltage / Vsup (V): 3

The low nominal supply voltage helps in optimizing power consumption and efficiency.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable signal transmission.

Maximum I (ol): 80 Amp

The high maximum output current allows for driving heavy loads without any issues.

Propagation Delay (tpd): 18 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The wide operating temperature range allows the product to be used in various conditions without any performance degradation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage allows for flexibility in the power supply configurations, accommodating a wide range of applications.

Technical Specifications

Bus Driver & Transceivers M74VHC1G125DFT1G-L22038 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

18 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

M74VHC1G125DFT1G-L22038 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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