Loading...

M74VHC1GT125DF1G

Onsemi

M74VHC1GT125DF1G by Onsemi

M74VHC1GT125DF1G by Onsemi is a 3.3V bus driver with 5 terminals and 16ns propagation delay. It operates in the temperature range of -55 to 125°C, suitable for military-grade applications requiring true output polarity and low enable control. The small outline package with a thin profile makes it ideal for space-constrained designs needing high-speed signal transmission.

Median Price

$0.035

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.035

10k+ parts

-

4,000

-

-

$0.035

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$0.300

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$0.300

-

-

-

Chip Stock

USA . 72,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

72,500

-

-

-

-

Cyclops Electronics Ltd

UK . 62,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

62,905

-

-

-

-

Vyrian

USA . 4,791 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,791

-

-

-

-

Digiode

USA . 2,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,263

-

-

-

-

ComSIT Distribution GmbH

Germany . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

J2 Sourcing AB

Sweden . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,613 parts In-Stock

1+ parts

$0.030

100+ parts

$0.029

1k+ parts

$0.029

10k+ parts

-

3,613

$0.030

$0.029

$0.029

-

Corohmni

South Africa . 410 parts In-Stock

1+ parts

$0.035

100+ parts

-

1k+ parts

-

10k+ parts

-

410

$0.035

-

-

-

Ampacity Inc.

Singapore . 3,520 parts In-Stock

1+ parts

$0.065

100+ parts

-

1k+ parts

-

10k+ parts

-

3,520

$0.065

-

-

-

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.068

100+ parts

$0.065

1k+ parts

$0.065

10k+ parts

-

20

$0.068

$0.065

$0.065

-

Microchip USA

USA . 305 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

10k+ parts

-

305

$0.296

-

-

-

Argo Parts USA

USA . 3,755 parts In-Stock

1+ parts

$0.300

100+ parts

-

1k+ parts

-

10k+ parts

$0.291

3,755

$0.300

-

-

$0.291

Continental Prestige Electronics

USA . 1,502 parts In-Stock

1+ parts

$0.300

100+ parts

-

1k+ parts

-

10k+ parts

$0.294

1,502

$0.300

-

-

$0.294

AZTECH Wire

Italy . 933 parts In-Stock

1+ parts

$13.220

100+ parts

-

1k+ parts

-

10k+ parts

-

933

$13.220

-

-

-

Aztec Data Supply Inc.

USA . 647 parts In-Stock

1+ parts

$27.370

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$27.370

-

-

-

RC Electronics

USA . 63,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63,801

-

-

-

-

Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

SupplyDigital Components

Austria . 6,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,992

-

-

-

-

Problanco Electronics

Mexico . 4,261 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,261

-

-

-

-

TANS Electronics

Latvia . 3,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,720

-

-

-

-

Assy Fe

Spain . 2,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,950

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

-

-

-

-

iodParts Technologies Inc.

India . 2,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,590

-

-

-

-

Alle Elektronik GmbH

Germany . 1,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

-

-

-

-

Corphita

USA . 1,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,141

-

-

-

-

Speed Components Ltd (Excess)

Israel . 820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

820

-

-

-

-

UHIMA Technologies

Türkiye . 768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

768

-

-

-

-

Kulean Microsystems

USA . 583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

583

-

-

-

-

Lixinc

USA . 426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

426

-

-

-

-

Kepictronics

USA . 410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

410

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$0.294

1k+ parts

$0.285

10k+ parts

$0.279

50

-

$0.294

$0.285

$0.279

Overview

Enhance your electronic designs with the M74VHC1GT125DF1G by Onsemi, a top-tier manufacturer known for its high-quality products. As a Bus Driver & Transceiver component, this versatile device offers seamless integration and reliability in various applications. Enjoy the benefits of its efficient performance and superior functionality, providing value and advantages that meet the needs of customers seeking cutting-edge solutions. Elevate your projects with the M74VHC1GT125DF1G and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and resistance to harsh environments, making it a reliable choice for industrial applications.

Surface Mount

YES - Allows for easy and efficient assembly onto circuit boards, saving time and labor costs in production processes.

Package Shape

RECTANGULAR - Maximizes space efficiency on PCBs, ideal for designs with limited real estate.

Nominal Supply Voltage / Vsup (V)

3.3 - Compatible with common power sources, ensuring seamless integration into existing systems.

Load Capacitance (CL)

50 pF - Offers stable and consistent performance with various load conditions, enhancing overall reliability.

Power Supplies (V)

3.3/5 - Provides flexibility in power options, accommodating different voltage requirements in diverse applications.

No. of Terminals

5 - Simplifies connectivity and reduces wiring complexity, facilitating installation and maintenance processes.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enables high-density mounting and space-saving designs, ideal for compact devices.

Maximum I (ol)

80 Amp - Supports high current output, making it suitable for driving power-hungry components or peripherals.

Propagation Delay (tpd)

16 ns - Ensures fast signal transmission and response times, crucial for time-sensitive applications.

Maximum Operating Temperature

125 °C - Offers reliable performance in extreme temperature conditions, suitable for rugged industrial environments.

Output Characteristics

3-STATE - Allows for tri-state output control, enhancing system flexibility and compatibility with a variety of devices.

Minimum Operating Temperature

55 °C - Maintains functionality in cold environments, making it suitable for outdoor or refrigeration applications.

Terminal Finish

Matte Tin (Sn) - annealed - Provides a durable and corrosion-resistant finish, ensuring long-term reliability and optimal electrical conductivity.

Terminal Position

DUAL - Facilitates easy installation and enhances signal integrity in crowded PCB layouts, ensuring stable performance.

No. of Ports

2 - Supports multiple data or signal routing paths, enabling versatile connectivity options for various system configurations.

Maximum Seated Height

1.1 mm - Low-profile design saves space and reduces interference with neighboring components, ideal for compact designs.

Width

1.25 mm - Compact form factor conserves board space and allows for high-density integration, suitable for miniaturized devices.

Output Polarity

TRUE - Provides accurate signal polarity for consistent data transmission, ensuring reliable communication in digital systems.

Minimum Supply Voltage (Vsup)

3 V - Compatible with low-voltage power sources, enabling energy-efficient operation and reducing power consumption.

Maximum Time At Peak Reflow Temperature (s)

40 - Resistant to high-temperature soldering processes, ensuring robust solder joints and reliable connections during assembly.

Peak Reflow Temperature °C

260 - Handles high-temperature reflow soldering, ensuring secure solder bonds and reliable electrical connections in manufacturing.

Length

2 mm - Compact size minimizes board space usage and allows for efficient PCB layout optimization, suitable for space-constrained applications.

Temperature Grade

MILITARY - Meets stringent military-grade specifications for durability and reliability, suitable for harsh operating conditions and mission-critical systems.

Technology

CMOS - Utilizes CMOS technology for low power consumption and high noise immunity, ensuring efficient operation and reliable signal integrity.

Terminal Form

GULL WING - Facilitates easy soldering and inspection during assembly, ensuring secure connections and reliable performance in demanding environments.

Packing Method

TR - Tape and reel packaging simplifies handling and automated assembly processes, increasing production efficiency and reducing costs.

Terminal Pitch

0.65 mm - Fine pitch spacing enables high-density mounting and compatibility with modern PCB designs, suitable for compact electronic devices.

Count Direction

UNIDIRECTIONAL - Supports data transmission in one direction, simplifying signal routing and reducing complexity in system design.

Control Type

ENABLE LOW - Allows for easy control of output signals with a simple enable/disable feature, enhancing system integration and functionality.

Maximum Supply Voltage (Vsup)

5.5 V - Compatible with a wide range of power sources, providing flexibility and versatility in various voltage applications.

Maximum Power Supply Current (ICC)

50 mA - Supports low power consumption, reducing energy usage and heat generation for efficient and reliable operation.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT125DF1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

M74VHC1GT125DF1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20