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M74VHC1G125DFT1G

Onsemi

M74VHC1G125DFT1G by Onsemi

M74VHC1G125DFT1G by Onsemi is a 3.3V bus driver with 5 terminals and 80A max I (ol). It operates in temperatures ranging from -55 to 125°C, suitable for military-grade applications. With a propagation delay of 16ns, it is ideal for unidirectional control systems requiring true output polarity.

Median Price

$0.223

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Nova Conductors

Japan . 500 parts In-Stock

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Dan-Mar Components

USA . 21,000 parts In-Stock

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Flip Electronics

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Bristol Electronics

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ComSIT Distribution GmbH

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Atlantic Semiconductor

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Lantek

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Semi Source

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Sea View Technologies

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Vyrian

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Ashlea Components Ltd

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Argo Parts USA

USA . 2,042 parts In-Stock

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$0.223

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$0.217

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Netroflash

USA . 50 parts In-Stock

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$0.223

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$0.219

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AZTECH Wire

Italy . 283 parts In-Stock

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$11.821

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Ampacity Inc.

Singapore . 1,290 parts In-Stock

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$15.000

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Aztec Data Supply Inc.

USA . 3,116 parts In-Stock

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Semicontronic

India . 997 parts In-Stock

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$34.000

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$33.150

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$32.980

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Perfect Parts

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RC Electronics

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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TANS Electronics

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Problanco Electronics

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GreenTree Electronics

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Metaverse IC Inc.

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Corphita

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South Africa . 479 parts In-Stock

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Microchip USA

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UHIMA Technologies

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Continental Prestige Electronics

USA . 1 parts In-Stock

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Overview

Enhance your electronic projects with the M74VHC1G125DFT1G by Onsemi, a top-tier manufacturer known for quality and reliability. This bus driver & transceiver offers seamless integration and exceptional performance, making it ideal for a wide range of applications. With its compact design and advanced features, this product provides unmatched value, efficiency, and versatility to customers looking to elevate their projects to the next level. Trust Onsemi for excellence in technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for transportation environments.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with many systems and reducing the need for additional components.

Power Supplies (V): 2/5.5

Wide range of power supply voltages (from 2V to 5.5V) provides flexibility in various applications.

Propagation Delay (tpd): 16 ns

Fast propagation delay of 16ns ensures quick signal transmission and response times, suitable for high-speed bus communication.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperatures, making it suitable for outdoor or harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers M74VHC1G125DFT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

M74VHC1G125DFT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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