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M74VHC1GT126DF2G

Onsemi

M74VHC1GT126DF2G by Onsemi

M74VHC1GT126DF2G by Onsemi is a 3.3/5V bus driver with 16ns propagation delay and 8A max I (ol). It is a CMOS technology component suitable for military applications, featuring a small outline package with dual terminals and true output polarity.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 8,147 parts In-Stock

1+ parts

$0.430

100+ parts

$0.126

1k+ parts

$0.085

10k+ parts

$0.057

8,147

$0.430

$0.126

$0.085

$0.057

Chip1Stop

Japan . 2,706 parts In-Stock

1+ parts

$1.560

100+ parts

$0.435

1k+ parts

$0.247

10k+ parts

-

2,706

$1.560

$0.435

$0.247

-

RS (Exports)

UK . 250 parts In-Stock

1+ parts

-

100+ parts

$0.163

1k+ parts

$0.117

10k+ parts

$0.112

250

-

$0.163

$0.117

$0.112

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$0.332

100+ parts

-

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-

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70

$0.332

-

-

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Maritex

Poland . 4,646 parts In-Stock

1+ parts

$0.400

100+ parts

$0.209

1k+ parts

$0.196

10k+ parts

$0.173

4,646

$0.400

$0.209

$0.196

$0.173

Digiode

USA . 1,601 parts In-Stock

1+ parts

$1.482

100+ parts

-

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1,601

$1.482

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Chip Stock

USA . 363,500 parts In-Stock

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363,500

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Cyclops Electronics Ltd

UK . 12,003 parts In-Stock

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12,003

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Vyrian

USA . 8,459 parts In-Stock

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8,459

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Bristol Electronics

USA . 1,883 parts In-Stock

1+ parts

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1,883

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Sea View Technologies

USA . 1,783 parts In-Stock

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1,783

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Inventory MP

USA . 100 parts In-Stock

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100

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Distributors (Availability)

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Semicontronic

India . 753 parts In-Stock

1+ parts

$0.010

100+ parts

$0.010

1k+ parts

$0.010

10k+ parts

-

753

$0.010

$0.010

$0.010

-

Ampacity Inc.

Singapore . 1,348 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

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1,348

$0.139

-

-

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Corohmni

South Africa . 476 parts In-Stock

1+ parts

$0.163

100+ parts

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476

$0.163

-

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Argo Parts USA

USA . 4,332 parts In-Stock

1+ parts

$0.332

100+ parts

-

1k+ parts

-

10k+ parts

$0.322

4,332

$0.332

-

-

$0.322

Continental Prestige Electronics

USA . 3,939 parts In-Stock

1+ parts

$0.332

100+ parts

-

1k+ parts

-

10k+ parts

$0.325

3,939

$0.332

-

-

$0.325

Corphita

USA . 1,747 parts In-Stock

1+ parts

$1.404

100+ parts

-

1k+ parts

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10k+ parts

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1,747

$1.404

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Aztec Data Supply Inc.

USA . 3,722 parts In-Stock

1+ parts

$13.870

100+ parts

-

1k+ parts

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10k+ parts

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3,722

$13.870

-

-

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$25.305

100+ parts

$23.028

1k+ parts

$20.750

10k+ parts

-

2,000

$25.305

$23.028

$20.750

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Authorized Procurement Solutions

USA . 59,995 parts In-Stock

1+ parts

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59,995

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Futuretech Components

Singapore . 15,000 parts In-Stock

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15,000

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iodParts Technologies Inc.

India . 11,441 parts In-Stock

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11,441

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SupplyDigital Components

Austria . 5,473 parts In-Stock

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5,473

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Infinite Electronics LLP (Excess)

. 5,010 parts In-Stock

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5,010

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Kulean Microsystems

USA . 3,548 parts In-Stock

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3,548

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Problanco Electronics

Mexico . 3,035 parts In-Stock

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3,035

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Assy Fe

Spain . 2,900 parts In-Stock

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2,900

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GreenTree Electronics

Israel . 2,826 parts In-Stock

1+ parts

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2,826

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

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1,800

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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1,200

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TANS Electronics

Latvia . 1,044 parts In-Stock

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1,044

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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144

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Microchip USA

USA . 112 parts In-Stock

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112

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Bastille Electronics

Australia . 68 parts In-Stock

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68

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Overview

Unlock the power of seamless communication with the M74VHC1GT126DF2G by Onsemi. Designed to meet the highest quality standards, this bus driver & transceiver offers unparalleled reliability and performance. Ideal for a wide range of applications, this product stands out for its value and benefits, providing customers with a competitive edge in their projects. Trust in Onsemi's expertise and experience to elevate your designs with the M74VHC1GT126DF2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount design allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape offers a compact and space-saving design, ideal for applications with limited board space.

Nominal Supply Voltage: 3V

The low nominal supply voltage helps reduce power consumption, making it energy-efficient and cost-effective.

Load Capacitance: 50 pF

The load capacitance ensures stable performance and signal integrity in high-speed communication applications.

Power Supplies: 3.3/5V

The multiple power supply options provide flexibility in voltage selection, accommodating various system requirements.

No. of Terminals: 5

The 5 terminals offer connectivity options for multiple input/output connections, enhancing versatility in design.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin profile design saves space and allows for dense packing in crowded circuit boards.

Maximum I (ol): 8 Amp

The high output current capability ensures robust and reliable signal transmission, suitable for demanding applications.

Propagation Delay: 16 ns

The low propagation delay time enables fast data transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 125 °C

The wide operating temperature range ensures reliable operation in harsh environmental conditions, enhancing product durability.

Output Characteristics: 3-STATE

The 3-state output feature allows for high impedance when disabled, preventing signal interference and ensuring signal integrity.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes it suitable for use in extreme cold environments, expanding the product's application range.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and conductivity, ensuring secure connections for long-lasting performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connectivity options, accommodating different circuit board layouts.

No. of Ports: 2

The 2 ports provide multiple connection points for data communication, allowing for versatile connectivity options in complex systems.

Maximum Seated Height: 1.1 mm

The low seated height allows for a compact and slim design, making it suitable for space-constrained applications.

Width: 1.25 mm

The narrow width dimension enables easy integration into tight spaces, ideal for compact electronic devices.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components, reducing the risk of errors.

Minimum Supply Voltage: 2V

The low minimum supply voltage requirement allows for operation in low-power scenarios, conserving energy and reducing costs.

Maximum Time At Peak Reflow Temperature: 30s

The extended time at peak reflow temperature ensures thorough soldering and reliable connections during assembly.

Peak Reflow Temperature: 260C

The high peak reflow temperature tolerance supports lead-free soldering processes, meeting environmental standards and regulations.

Length: 2 mm

The compact length dimension provides flexibility in placement and installation, suitable for various board layouts and designs.

Temperature Grade: MILITARY

The military-grade temperature rating ensures high reliability and performance in rugged and demanding operating conditions.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-powered devices and noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides strong and reliable solder connections, enhancing durability and performance in demanding environments.

Packing Method: TR

The tape and reel packaging method simplifies handling and automated assembly processes, improving efficiency and reducing production costs.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on circuit boards, maximizing space utilization and component placement.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies installation and operation, ensuring proper signal transmission and functionality.

Control Type: ENABLE HIGH

The enable high control type offers easy integration and operation, allowing for straightforward system control and management.

Maximum Supply Voltage: 5.5V

The high maximum supply voltage tolerance provides excellent compatibility with various power sources, ensuring stable operation and protection against voltage spikes.

Maximum Power Supply Current: 50 mA

The low maximum power supply current requirement helps minimize power consumption and heat dissipation, enhancing energy efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT126DF2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GT126DF2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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