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M74VHC1GT126DT1G

Onsemi

M74VHC1GT126DT1G by Onsemi

M74VHC1GT126DT1G by Onsemi is a 3.3/5V bus driver with 16ns propagation delay and 8A max I (ol). It is ideal for applications requiring true output polarity, such as military-grade systems, with a small outline package style and dual terminal position.

Median Price

$0.212

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 2 parts In-Stock

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$0.336

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DigiKey

USA . 1,022 parts In-Stock

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$0.420

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$0.155

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$0.104

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Arrow

USA . 8,880 parts In-Stock

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$0.427

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$0.137

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$0.100

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$0.083

8,880

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$0.137

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$0.083

Element14

Singapore . 3 parts In-Stock

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$2.360

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Rochester

USA . 152,779 parts In-Stock

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$0.087

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$0.072

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$0.064

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Verical

USA . 101,980 parts In-Stock

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Mouser Electronics

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Chip1Stop

Japan . 810 parts In-Stock

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$0.084

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810

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Distributors (In-Stock)

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Digiode

USA . 843 parts In-Stock

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$0.067

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$0.067

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Nova Conductors

Japan . 100 parts In-Stock

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Chip Stock

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Vyrian

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A&K Electronics

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Rotakorn

Sweden . 18,000 parts In-Stock

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Bristol Electronics

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Cyclops Electronics Ltd

UK . 12,010 parts In-Stock

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ComSIT Distribution GmbH

Germany . 11,678 parts In-Stock

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Diverse Electronics

Canada . 9,000 parts In-Stock

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Netsource Technology, Inc.

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Dan-Mar Components

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Semi Source

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Next Level Components, LLC

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ACDS - Activité Composants Distribution Service

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Microfarads

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Contempo Components LLC

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Prism Electronics

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Semicontronic

India . 30,355 parts In-Stock

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$0.060

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$0.058

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$0.060

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Corphita

USA . 1,401 parts In-Stock

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Component Stockers USA

USA . 245,524 parts In-Stock

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$0.070

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$0.060

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245,524

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$0.070

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$0.060

Corohmni

South Africa . 476 parts In-Stock

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$0.071

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Argo Parts USA

USA . 3,022 parts In-Stock

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$0.109

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Continental Prestige Electronics

USA . 1,754 parts In-Stock

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$0.109

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Ampacity Inc.

Singapore . 30,206 parts In-Stock

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$0.131

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Aztec Data Supply Inc.

USA . 233 parts In-Stock

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$24.880

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Perfect Parts

USA . 208,648 parts In-Stock

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Lixinc

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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Authorized Procurement Solutions

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 6,138 parts In-Stock

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TANS Electronics

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Problanco Electronics

Mexico . 5,589 parts In-Stock

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SupplyDigital Components

Austria . 5,163 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,092 parts In-Stock

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iodParts Technologies Inc.

India . 3,020 parts In-Stock

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Formix International (Excess)

India . 3,000 parts In-Stock

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Computer Components Inc. - USA

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UHIMA Technologies

Türkiye . 787 parts In-Stock

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Kulean Microsystems

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Overview

Enhance your electronic designs with the M74VHC1GT126DT1G by Onsemi, a top-tier manufacturer known for delivering high-quality bus drivers and transceivers. This versatile component offers a plethora of applications and benefits, from its compact package design to its efficient power supply capabilities. With a wide operating temperature range and low power consumption, this product provides unmatched value for customers seeking reliable performance in their projects. Upgrade your circuits today with the M74VHC1GT126DT1G and experience superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the product is lightweight, making it ideal for use in various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the product energy-efficient and suitable for low-power applications.

Propagation Delay (tpd): 16 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication systems.

Output Characteristics: 3-STATE

3-STATE output allows the bus driver to disconnect from the bus line, providing flexibility in controlling the signal flow.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT126DT1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

M74VHC1GT126DT1G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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