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M74VHC1GT126DF1G-L22038

Onsemi

M74VHC1GT126DF1G-L22038 by Onsemi

M74VHC1GT126DF1G-L22038 by Onsemi is a 3-STATE bus driver with 5 terminals, operating at -55 to 125 °C. It has a load capacitance of 50 pF, max I (ol) of 8A, and propagation delay of 16ns. Ideal for applications requiring true output polarity and enable high control type in compact designs.

Median Price

$0.188

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 559 parts In-Stock

1+ parts

$0.300

100+ parts

$0.116

1k+ parts

$0.059

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$0.029

559

$0.300

$0.116

$0.059

$0.029

EBV Elektronik

Germany . 36,000 parts In-Stock

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DigiKey

USA . 15,000 parts In-Stock

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$0.400

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$0.400

Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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Verical

USA . 3,000 parts In-Stock

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Chip1Stop

Japan . 2,817 parts In-Stock

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$0.075

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$0.053

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$0.052

2,817

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

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$0.062

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$0.062

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Digiode

USA . 1,571 parts In-Stock

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$0.285

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Cyclops Electronics Ltd

UK . 676,879 parts In-Stock

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Martec Srl

Italy . 73,847 parts In-Stock

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TME

Poland . 15,000 parts In-Stock

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Vyrian

USA . 12,400 parts In-Stock

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Flip Electronics

USA . 12,000 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 12,283 parts In-Stock

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$0.025

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$0.024

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$0.024

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Ampacity Inc.

Singapore . 12,144 parts In-Stock

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$0.025

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Corohmni

South Africa . 429 parts In-Stock

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Continental Prestige Electronics

USA . 6,876 parts In-Stock

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$0.060

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Argo Parts USA

USA . 1,041 parts In-Stock

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$0.060

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$0.060

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Aranea Global

USA . 500 parts In-Stock

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$0.061

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$0.058

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500

$0.061

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Corphita

USA . 1,204 parts In-Stock

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$0.270

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$10.631

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$10.099

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$10.099

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$10.631

$10.099

$10.099

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Aztec Data Supply Inc.

USA . 3,607 parts In-Stock

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$33.180

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Kulean Microsystems

USA . 8,130 parts In-Stock

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Microchip USA

USA . 4,001 parts In-Stock

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SupplyDigital Components

Austria . 3,430 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,818 parts In-Stock

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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Formix International (Excess)

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TANS Electronics

Latvia . 415 parts In-Stock

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Overview

Enhance your electronic designs with the M74VHC1GT126DF1G-L22038 by Onsemi. Known for their top-notch quality and reliability, Onsemi delivers innovative solutions in the Bus Driver & Transceivers category. This versatile component offers a wide range of applications, making it a valuable addition to any project. With fast propagation delay, high output current, and true output polarity, this product provides exceptional performance and efficiency. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your designs with the M74VHC1GT126DF1G-L22038 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V is common and widely compatible, making this product suitable for a range of applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand heat and operate reliably in demanding conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, contributing to the overall efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT126DF1G-L22038 attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GT126DF1G-L22038 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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