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M74VHC1GT126DF1G

Onsemi

M74VHC1GT126DF1G by Onsemi

M74VHC1GT126DF1G by Onsemi is a 3.3/5V bus driver with 16ns propagation delay, suitable for military applications. It features a 50pF load capacitance, 8A max I (ol), and operates in temperatures ranging from -55 to 125 °C. Ideal for enabling high control type in unidirectional systems.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 650 parts In-Stock

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$1.000

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Cyclops Electronics Ltd

UK . 36,306 parts In-Stock

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Chip Stock

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Vyrian

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Bristol Electronics

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Digiode

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Contempo Components LLC

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NPI Materials, Inc.

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Prism Electronics

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Argo Parts USA

USA . 4,801 parts In-Stock

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$0.229

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$0.222

4,801

$0.229

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Continental Prestige Electronics

USA . 1,400 parts In-Stock

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$0.229

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$0.224

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Netroflash

USA . 100 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 259 parts In-Stock

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$12.747

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Aztec Data Supply Inc.

USA . 4,596 parts In-Stock

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$22.540

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$31.735

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$30.149

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$30.149

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$31.735

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Semicontronic

India . 1,063 parts In-Stock

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$43.000

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$41.925

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$41.710

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Ampacity Inc.

Singapore . 192 parts In-Stock

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$54.000

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RC Electronics

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 7,500 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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TANS Electronics

Latvia . 2,768 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,700 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,800 parts In-Stock

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Robosynatics

Brazil . 1,798 parts In-Stock

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Lucentia Tech

USA . 1,798 parts In-Stock

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Lixinc

USA . 1,772 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 576 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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Corphita

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Microchip USA

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Corohmni

South Africa . 76 parts In-Stock

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Overview

Enhance your electronic designs with the M74VHC1GT126DF1G by Onsemi, a top-tier manufacturer known for delivering high-quality components. As a Bus Driver & Transceiver, this product offers unmatched reliability and performance for various applications. With a nominal supply voltage of 3V and 3-STATE output characteristics, it provides seamless integration and efficient operation. Experience the benefits of its advanced technology, compact design, and wide temperature range, making it ideal for military-grade applications. Trust Onsemi to deliver value and innovation with every component, ensuring optimal results for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for use in various applications without compromising on quality.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V provides efficiency and power saving benefits, making it an energy-efficient choice for bus driver applications.

Propagation Delay (tpd): 16 ns

With a low propagation delay of 16ns, the product ensures fast and reliable data transmission, crucial for bus driver and transceiver functions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the product can withstand harsh environmental conditions, making it suitable for industrial and military applications.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT126DF1G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

M74VHC1GT126DF1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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