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74LVC1G125GV-Q100

NXP Semiconductors

74LVC1G125GV-Q100 by NXP Semiconductors

NXP Semiconductors' 74LVC1G125GV-Q100 is a CMOS bus driver with 6 ns propagation delay, suitable for automotive applications. It operates at 3.3V, has 5 terminals in a small outline package, and supports up to 24 Amp output current with TRUE polarity.

Median Price

$0.046

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 10,822 parts In-Stock

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$0.130

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$0.060

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$0.053

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$0.049

10,822

$0.130

$0.060

$0.053

$0.049

DigiKey

USA . 5,314 parts In-Stock

1+ parts

$0.130

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$0.065

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$0.053

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$0.047

5,314

$0.130

$0.065

$0.053

$0.047

Adafruit Industries

USA . 60 parts In-Stock

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$11.582

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$11.003

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$11.003

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60

$11.582

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$11.003

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TTI

USA . 798,000 parts In-Stock

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$0.042

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Rochester

USA . 164,402 parts In-Stock

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$0.050

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$0.041

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$0.037

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$0.050

$0.041

$0.037

EBV Elektronik

Germany . 18,000 parts In-Stock

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Arrow

USA . 9,000 parts In-Stock

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Verical

USA . 9,000 parts In-Stock

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$0.037

Chip1Stop

Japan . 6,000 parts In-Stock

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$0.043

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$0.043

Distributors (In-Stock)

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Digiode

USA . 3,129 parts In-Stock

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$0.039

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Nova Conductors

Japan . 88 parts In-Stock

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$0.093

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Chip Stock

USA . 126,000 parts In-Stock

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Sensible Micro Corp

USA . 8,882 parts In-Stock

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Vyrian

USA . 7,601 parts In-Stock

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Anansix

USA . 1,786 parts In-Stock

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VNN

France . 998 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 120,636 parts In-Stock

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$0.035

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$0.035

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Semicontronic

India . 120,287 parts In-Stock

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$0.035

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$0.034

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$0.034

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$0.035

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Corphita

USA . 4,770 parts In-Stock

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$0.037

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AZTECH Wire

Italy . 5,595 parts In-Stock

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$0.050

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Aranea Global

USA . 500 parts In-Stock

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$0.091

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$0.087

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500

$0.091

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$0.087

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Continental Prestige Electronics

USA . 6,314 parts In-Stock

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$0.093

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$0.091

6,314

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$0.091

Argo Parts USA

USA . 962 parts In-Stock

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$0.090

962

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Microchip USA

USA . 6,574 parts In-Stock

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$0.510

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Andel Nordic

Denmark . 209 parts In-Stock

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$4.125

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$3.960

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$3.960

209

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$3.960

$3.960

Corohmni

South Africa . 205 parts In-Stock

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$24.309

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Aztec Data Supply Inc.

USA . 64 parts In-Stock

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$32.979

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Glotronic Ltd.

UK . 4,800 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,422 parts In-Stock

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Futuretech Components

Singapore . 2,980 parts In-Stock

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UNI Independent Distributors

Spain . 1,266 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 637 parts In-Stock

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Metaverse IC Inc.

Canada . 240 parts In-Stock

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Kepictronics

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Overview

Enhance your automotive applications with the 74LVC1G125GV-Q100 by NXP Semiconductors. With a compact design and AEC-Q100 screening, this bus driver & transceiver provides reliable performance in demanding environments. Experience fast propagation delays and low power consumption, making it an ideal choice for efficient signal transmission. Trust NXP Semiconductors for quality products that deliver exceptional value and reliability. Elevate your designs with the 74LVC1G125GV-Q100 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resilience, making the product suitable for automotive applications where it may be exposed to harsh environments.

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay allows for fast signal transmission, improving the efficiency of the bus driver and transceivers.

Surface Mount: YES

Surface mount capability provides ease of PCB assembly and space-saving benefits, making this product convenient for compact designs.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, essential for automotive applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level, making it compatible with many systems and devices.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient signal transmission and reception in a bus driver and transceiver setup.

Power Supplies (V): 3.3

Stable power supply ensures consistent performance and reliability in various automotive applications.

No. of Terminals: 5

Sufficient terminals for connecting to other components and devices, enabling versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and space-saving package design allows for flexibility in PCB layout and integration in tight spaces.

Maximum I (ol): 24 Amp

High output current capability enables driving of multiple loads efficiently in automotive electronic systems.

Propagation Delay (tpd): 10.5 ns

Low propagation delay ensures rapid signal transmission, essential for real-time communication in automotive applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for automotive environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Operating at low temperatures allows for reliable performance even in cold weather conditions.

Terminal Finish: Tin (Sn)

Tin finish provides good conductivity and solderability, ensuring secure connections during PCB assembly.

No. of Ports: 2

Multiple ports enable versatile connectivity options for interfacing with different devices and systems.

Length: 2.9 mm

Compact length facilitates space-saving integration in electronic systems, especially in automotive applications.

Temperature Grade: AUTOMOTIVE

Designed and rated for automotive-grade performance, ensuring durability and reliability in harsh automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for automotive electronic systems.

Terminal Pitch: 0.95 mm

Optimal terminal pitch for easy PCB mounting and soldering, enhancing the overall assembly process.

Control Type: ENABLE LOW

Enable low control type provides flexibility in managing the output state of the device, offering customization options.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range allows compatibility with various systems and voltage levels, enhancing versatility.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GV-Q100 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

74LVC1G125GV-Q100 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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