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M74VHC1GT125DF2G

Onsemi

M74VHC1GT125DF2G by Onsemi

M74VHC1GT125DF2G by Onsemi is a 3.3V bus driver with 5 terminals and 80A max I (ol). It operates in temperatures ranging from -55 to 125 °C, featuring a propagation delay of 16ns. Ideal for military applications requiring true output polarity and low enable control.

Median Price

$0.048

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 69,000 parts In-Stock

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Arrow

USA . 18,000 parts In-Stock

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$0.324

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$0.324

Verical

USA . 15,000 parts In-Stock

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$0.044

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$0.044

Rochester

USA . 15,000 parts In-Stock

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$0.048

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$0.040

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$0.036

15,000

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$0.048

$0.040

$0.036

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$0.071

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Chip Stock

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Speed Components Ltd

Israel . 6,000 parts In-Stock

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Vyrian

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Connector Distribution Corp

USA . 2,030 parts In-Stock

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Right Parts Inc.

USA . 2,030 parts In-Stock

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Digiode

USA . 1,299 parts In-Stock

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Bristol Electronics

USA . 876 parts In-Stock

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$0.113

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$0.068

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Cyclops Electronics Ltd

UK . 769 parts In-Stock

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769

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Microfarads

USA . 480 parts In-Stock

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Innovative Industries

USA . 390 parts In-Stock

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$2.000

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Prism Electronics

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Distributors (Availability)

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Semicontronic

India . 28,890 parts In-Stock

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$0.033

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$0.032

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$0.032

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28,890

$0.033

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$0.032

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Ampacity Inc.

Singapore . 28,820 parts In-Stock

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$0.033

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$0.033

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Continental Prestige Electronics

USA . 4,348 parts In-Stock

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$0.071

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$0.069

4,348

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$0.069

Argo Parts USA

USA . 1,101 parts In-Stock

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$0.068

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Netroflash

USA . 1,000 parts In-Stock

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$0.071

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$0.067

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$0.066

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$0.071

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$0.067

$0.066

Corohmni

South Africa . 244 parts In-Stock

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$0.091

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AZTECH Wire

Italy . 566 parts In-Stock

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$8.640

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Aztec Data Supply Inc.

USA . 3,073 parts In-Stock

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Kepictronics

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Lixinc

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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A-Z Elektronik GmbH

Germany . 2,760 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,840 parts In-Stock

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Corphita

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UHIMA Technologies

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TANS Electronics

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Microchip USA

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Overview

Experience the next level of performance with the M74VHC1GT125DF2G by Onsemi, a top-tier manufacturer known for delivering high-quality solutions in the Bus Driver & Transceivers category. This versatile product offers a wide range of applications and benefits, ensuring reliable operation and seamless communication in various systems. With a focus on value and innovation, this component guarantees exceptional performance, making it the ideal choice for customers looking for efficiency and reliability in their projects. Elevate your designs with the M74VHC1GT125DF2G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver, making it a reliable choice for long-term use.

Nominal Supply Voltage / Vsup (V): 3.3

The optimal supply voltage ensures stable performance of the bus driver, reducing the risk of malfunctions or errors.

Propagation Delay (tpd): 16 ns

The low propagation delay indicates quick signal transmission, enhancing the efficiency of the bus driver in processing data.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this bus driver can withstand harsh environmental conditions without compromising its functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this bus driver energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers M74VHC1GT125DF2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

80 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

1.25 mm

Trade Compliance

M74VHC1GT125DF2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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