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74HC1G125GW

NXP Semiconductors

74HC1G125GW by NXP Semiconductors

NXP Semiconductors' 74HC1G125GW is a CMOS bus driver with 30ns propagation delay, suitable for automotive applications. It operates at supply voltages from 2V to 6V, features a 3-STATE output and can handle up to 6A of current. The small outline package has a rectangular shape and measures 2.05mm in length, making it ideal for space-constrained designs.

Median Price

$0.164

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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RS (Exports)

UK . 1,700 parts In-Stock

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Nova Conductors

Japan . 81 parts In-Stock

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VNN

France . 32,256 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 12,480 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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Vyrian

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ComSIT Distribution GmbH

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Anansix

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Digiode

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LIBRA Elektronik GmbH

Germany . 1,197 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Semi Source

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Continental Prestige Electronics

USA . 4,058 parts In-Stock

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Argo Parts USA

USA . 2,336 parts In-Stock

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Semicontronic

India . 1,357 parts In-Stock

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AZTECH Wire

Italy . 10,218 parts In-Stock

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Ampacity Inc.

Singapore . 1,231 parts In-Stock

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Andel Nordic

Denmark . 170 parts In-Stock

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Advanced Electronics

New Zealand . 39 parts In-Stock

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Corohmni

South Africa . 337 parts In-Stock

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Aztec Data Supply Inc.

USA . 12,492 parts In-Stock

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Overview

Elevate your circuit designs with the 74HC1G125GW by NXP Semiconductors, a top-notch bus driver & transceiver that guarantees high-quality performance. With NXP's reputation for reliability and innovation, this product offers unmatched value to customers seeking seamless communication solutions. Ideal for a wide range of applications, this component ensures efficient signal transmission and control with its advanced features. Upgrade your projects today with the 74HC1G125GW and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it suitable for various environments.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast and efficient signal transmission, ideal for time-sensitive applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

This shape allows for compact and space-saving placement on PCBs, ideal for applications with limited space.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable and reliable signal transmission, reducing the risk of errors.

Power Supplies (V): 2/6

Compatible with a range of power supplies, offering flexibility in design and application.

No. of Terminals: 5

The small number of terminals simplifies installation and reduces the risk of wiring errors.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space on PCBs and allows for denser circuit designs.

Maximum I (ol): 6 Amp

High output current capability enables driving of multiple loads without overheating or performance degradation.

Technical Specifications

Bus Driver & Transceivers 74HC1G125GW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74HC1G125GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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