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SN74LVC4245ADW

Texas Instruments

SN74LVC4245ADW by Texas Instruments

SN74LVC4245ADW by Texas Instruments is an 8-bit bus driver with 3V & 5V translation, featuring a propagation delay of 6.7 ns. It operates at a nominal voltage of 5V and has a load capacitance of 50 pF. Ideal for bidirectional applications requiring common control in industrial settings.

Median Price

$1.590

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

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Texas Instruments

USA . 20,727 parts In-Stock

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Mouser Electronics

USA . 3,929 parts In-Stock

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RS (Exports)

UK . 1,175 parts In-Stock

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Arrow

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Nova Conductors

Japan . 600 parts In-Stock

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Digiode

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Forefront Electronics and Design

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Infinite Electronics LLP

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Connector Distribution Corp

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Right Parts Inc.

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Goldney Electronics S.L.

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Prism Electronics

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TME

Poland . 90 parts In-Stock

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ComSIT Distribution GmbH

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Speed Components Ltd

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Bristol Electronics

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Odi Ramu Company

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Microfarads

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Cogito LLC

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Inventory MP

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LWI Electronics Inc

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Sunrise Surplus Inc.

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QIE Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,295 parts In-Stock

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$0.910

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Semicontronic

India . 8,040 parts In-Stock

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$0.910

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$0.887

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$0.883

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Argo Parts USA

USA . 3,936 parts In-Stock

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$0.970

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Continental Prestige Electronics

USA . 3,359 parts In-Stock

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Corphita

USA . 224 parts In-Stock

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$1.272

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Parana Technologies

USA . 482 parts In-Stock

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$7.709

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$8.238

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$8.390

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$7.971

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DigiPath Technology Company

USA . 137 parts In-Stock

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$8.489

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$7.810

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ChromeModa Solutions

Germany . 5,307 parts In-Stock

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$8.662

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IDEA Electronic Components Group

UK . 221 parts In-Stock

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$8.229

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Microchip USA

USA . 3,273 parts In-Stock

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Corohmni

South Africa . 705 parts In-Stock

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Andel Nordic

Denmark . 369 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

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Bastille Electronics

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Cyclops Electronics Ltd (Excess)

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Overview

Enhance your electronic projects with the SN74LVC4245ADW by Texas Instruments, a top-notch Bus Driver & Transceiver that delivers seamless data transmission between 3V and 5V systems. With a compact design and reliable performance, this product boasts a fast propagation delay of 6.7 ns, making it ideal for industrial applications. Trust in Texas Instruments' reputation for quality and innovation, and experience the value of smooth signal translation and efficient operation that the SN74LVC4245ADW brings to your projects. Elevate your designs with this versatile component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver/transceiver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 6.7 ns

Low propagation delay enables fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard PCB layouts and facilitates space-efficient design.

No. of Bits: 8

8-bit configuration provides sufficient data handling capacity for various communication protocols and interfaces.

Translation: 3V & 5V

Support for multiple supply voltage levels allows for versatile compatibility with different system requirements.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance and reliability of the bus driver/transceiver.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient signal transmission and reception, minimizing signal distortion and noise.

Power Supplies (V): 3.3

Support for 3.3V power supplies allows for compatibility with a wide range of devices and systems using this voltage level.

No. of Terminals: 24

Sufficient number of terminals for connecting to various external components and interfacing with other devices in the system.

Technical Specifications

Bus Driver & Transceivers SN74LVC4245ADW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

5V SUPPLY FOR PORT A; 3.3V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.13 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

6.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

7.5 mm

Trade Compliance

SN74LVC4245ADW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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