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SN74LVC8T245RHLR

Texas Instruments

SN74LVC8T245RHLR by Texas Instruments

Texas Instruments SN74LVC8T245RHLR is an 8-bit bus driver with 6.3ns propagation delay, operating at 1.8V supply voltage. It features a 3-STATE output and supports bidirectional communication in industrial applications. This chip has a compact rectangular package for surface mounting, making it suitable for various electronic designs requiring efficient signal translation.

Median Price

$1.298

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 57,458 parts In-Stock

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$1.208

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$0.929

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$0.489

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57,458

$1.208

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Arrow

USA . 725 parts In-Stock

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$1.387

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$0.735

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$0.679

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725

$1.387

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$0.679

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Chip1Stop

Japan . 1,505 parts In-Stock

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$1.430

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Verical

USA . 725 parts In-Stock

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$0.735

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$0.679

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725

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$0.735

$0.679

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Distributors (In-Stock)

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EXC GmbH

Germany . 651 parts In-Stock

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$0.545

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651

$0.545

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Maritex

Poland . 22 parts In-Stock

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$0.797

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$0.396

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$0.307

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22

$0.797

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$0.307

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Nova Conductors

Japan . 15 parts In-Stock

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$0.848

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Digiode

USA . 1,057 parts In-Stock

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$1.148

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Mobius Materials

USA . 259 parts In-Stock

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$6.324

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$5.041

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Vyrian

USA . 14,273 parts In-Stock

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Cyclops Electronics Ltd

UK . 7,747 parts In-Stock

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Chip Stock

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Bristol Electronics

USA . 1,100 parts In-Stock

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Atlantic Semiconductor

USA . 280 parts In-Stock

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AGACORP

USA . 119 parts In-Stock

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SPM Sales

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Semi Source

USA . 23 parts In-Stock

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Cogito LLC

Ukraine . 18 parts In-Stock

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Prism Electronics

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Sensible Micro Corp

USA . 6 parts In-Stock

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$1.034

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$0.954

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6

-

$1.034

$0.954

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Rebound Electronics

UK . 2 parts In-Stock

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2

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LWI Electronics Inc

India . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,586 parts In-Stock

1+ parts

$0.620

100+ parts

-

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14,586

$0.620

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Argo Parts USA

USA . 3,767 parts In-Stock

1+ parts

$0.848

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3,767

$0.848

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Corphita

USA . 1,177 parts In-Stock

1+ parts

$1.087

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$1.087

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Semicontronic

India . 14,700 parts In-Stock

1+ parts

$1.360

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$1.326

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$1.319

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14,700

$1.360

$1.326

$1.319

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Andel Nordic

Denmark . 981 parts In-Stock

1+ parts

$2.667

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$2.560

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$2.560

981

$2.667

-

$2.560

$2.560

Continental Prestige Electronics

USA . 246 parts In-Stock

1+ parts

$2.667

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$2.640

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$2.560

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$2.560

246

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$2.560

Corohmni

South Africa . 59 parts In-Stock

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$16.161

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59

$16.161

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$16.779

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$15.940

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$15.940

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3,000

$16.779

$15.940

$15.940

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Parana Technologies

USA . 1,292 parts In-Stock

1+ parts

$17.897

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$1,662.009

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$16.107

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1,292

$17.897

$1,662.009

$16.107

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DigiPath Technology Company

USA . 425 parts In-Stock

1+ parts

$19.707

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425

$19.707

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IDEA Electronic Components Group

UK . 1,943 parts In-Stock

1+ parts

$20.109

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$19.104

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$18.098

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1,943

$20.109

$19.104

$18.098

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ChromeModa Solutions

Germany . 576 parts In-Stock

1+ parts

$20.109

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$16.489

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576

$20.109

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Modulus Dynamics

Lithuania . 1,376 parts In-Stock

1+ parts

$30.684

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$30.684

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$30.684

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1,376

$30.684

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 8,000 parts In-Stock

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S.R.D Solutions

India . 7,100 parts In-Stock

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Lixinc

USA . 4,765 parts In-Stock

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Futuretech Components

Singapore . 2,398 parts In-Stock

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2,398

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Kepictronics

USA . 1,739 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,632 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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iodParts Technologies Inc.

India . 754 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.831

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$0.806

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$0.789

500

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$0.831

$0.806

$0.789

Assy Fe

Spain . 465 parts In-Stock

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465

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Robosynatics

Brazil . 247 parts In-Stock

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$27.371

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$26.813

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$26.813

247

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$27.371

$26.813

$26.813

Lucentia Tech

USA . 247 parts In-Stock

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$27.371

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$26.813

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$26.813

247

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$27.371

$26.813

$26.813

Speed Components Ltd (Excess)

Israel . 40 parts In-Stock

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Overview

Enhance your electronic designs with the SN74LVC8T245RHLR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of innovative products like this bus driver & transceiver. Ideal for various applications, this chip carrier boasts efficient translation capabilities and a 3-state output characteristic. With a compact package style and a wide operating temperature range, this versatile component ensures seamless data transmission while maximizing performance. Elevate your projects with the exceptional value and benefits that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for bus driver applications.

Propagation Delay At Nominal Supply: 6.3 ns

With a low propagation delay, this product ensures fast and efficient signal transmission in bus systems.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into bus driver circuits.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space in bus driver assemblies.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transmission requirements in bus driver applications.

Translation: 1.8/5.5V&1.8/5.5V

The dual voltage translation capability ensures compatibility with various power supplies in bus systems.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage enables energy-efficient operation in bus driver applications.

Load Capacitance (CL): 15 pF

The low load capacitance helps in minimizing signal distortion and ensuring reliable communication in buses.

Power Supplies (V): 3.3

With support for 3.3V power supplies, this product is compatible with standard bus system configurations.

No. of Terminals: 24

The 24 terminals offer flexibility in connecting the bus driver to other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide options for optimizing heat dissipation and space constraints in bus driver setups.

Maximum I (ol): 32 Amp

The high maximum output current capacity ensures reliable performance of the bus driver even under heavy loads.

Technical Specifications

Bus Driver & Transceivers SN74LVC8T245RHLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPEARATE CONFIGURABLE POWER-SUPPLY RAILS FOR PORT A AND B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PQCC-N24

JESD-609 Code:

e4

Length:

5.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24/28,.14X.2,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.025 mA

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

23.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

1.8/5.5V&1.8/5.5V

Width:

3.5 mm

Trade Compliance

SN74LVC8T245RHLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-649-9480, 5962016499480

NIIN

016499480

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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