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SN74HC244DBR

Texas Instruments

SN74HC244DBR by Texas Instruments

SN74HC244DBR by Texas Instruments is a 4-bit bus driver with 29ns propagation delay, suitable for industrial applications. It features 3-STATE output characteristics, operates at a supply voltage of 5V, and has a max power supply current of 0.08mA. This CMOS technology device comes in a small outline package with dual terminals and enables low control type.

Median Price

$0.244

Lifecycle Status

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29

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1k+

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Chip1Stop

Japan . 1,583 parts In-Stock

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Arrow

USA . 1,823 parts In-Stock

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Adafruit Industries

USA . 100 parts In-Stock

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Texas Instruments

USA . 35,057 parts In-Stock

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Mouser Electronics

USA . 13,298 parts In-Stock

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DigiKey

USA . 6,157 parts In-Stock

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RS (Exports)

UK . 3,725 parts In-Stock

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Rochester

USA . 2,668 parts In-Stock

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Verical

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Digiode

USA . 1,889 parts In-Stock

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Nova Conductors

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Maritex

Poland . 1 parts In-Stock

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Chip Stock

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Vyrian

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Velocity Electronics

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DigiKey Marketplace

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ECAB

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Bristol Electronics

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Prism Electronics

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Inventory MP

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ComSIT Distribution GmbH

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Atlantic Semiconductor

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Semicontronic

India . 7,685 parts In-Stock

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Corphita

USA . 4,400 parts In-Stock

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Corohmni

South Africa . 181 parts In-Stock

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Continental Prestige Electronics

USA . 5,264 parts In-Stock

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Argo Parts USA

USA . 2,588 parts In-Stock

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Netroflash

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Ampacity Inc.

Singapore . 7,530 parts In-Stock

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Microchip USA

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Andel Nordic

Denmark . 3,352 parts In-Stock

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Parana Technologies

USA . 1,607 parts In-Stock

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DigiPath Technology Company

USA . 1,838 parts In-Stock

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ChromeModa Solutions

Germany . 4,903 parts In-Stock

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IDEA Electronic Components Group

UK . 2,238 parts In-Stock

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Perfect Parts

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Kepictronics

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GreenTree Electronics

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Overview

Enhance your electronic designs with the SN74HC244DBR from Texas Instruments, a top-tier manufacturer known for producing high-quality components. As part of the Bus Driver & Transceivers category, this product offers reliable signal transmission and efficient data flow in various applications. With its 3-STATE output characteristics and low propagation delay, customers can expect seamless performance and improved system functionality. Trust Texas Instruments to deliver superior products like the SN74HC244DBR that provide value, benefits, and advantages to meet your design needs. Elevate your projects with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 29 ns

With a low propagation delay at nominal supply, this product ensures fast and efficient signal transmission, making it suitable for high-speed communication systems.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard power sources, making integration into existing systems hassle-free.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, allowing for tri-state outputs that can be effectively used in bus driver applications.

Technical Specifications

Bus Driver & Transceivers SN74HC244DBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74HC244DBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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