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74LVC1G66GW

NXP Semiconductors

74LVC1G66GW by NXP Semiconductors

NXP Semiconductors' 74LVC1G66GW is a CMOS bus driver with 3 ns propagation delay, operating b/w -40 to 125 °C. It features 5 terminals in a small outline package, suitable for automotive applications requiring true output polarity and 3-state characteristics.

Median Price

$0.087

Lifecycle Status

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Partservice

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Micros sp.j. W. Kędra i J. Lic

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Distributors (Availability)

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Andel Nordic

Denmark . 2,824 parts In-Stock

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Ampacity Inc.

Singapore . 1,023 parts In-Stock

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AZTECH Wire

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Advanced Electronics

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Aztec Data Supply Inc.

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Overview

Unlock seamless data transmission with the 74LVC1G66GW by NXP Semiconductors. As a leader in innovative semiconductor solutions, NXP delivers top-notch quality and reliability in the Bus Driver & Transceivers category. Whether you're designing for automotive applications or IoT devices, this product offers unparalleled value with its high performance and efficiency. Say goodbye to transmission delays and hello to a smoother operation with the 74LVC1G66GW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

Ease of installation and space-saving design make it convenient for integration into electronic systems.

Nominal Supply Voltage / Vsup (V): 2.7

Optimal supply voltage for efficient performance without risking damage to the components.

Propagation Delay (tpd): 3 ns

Fast signal propagation ensures quick communication between devices, essential in bus drivers and transceivers.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for use in automotive and industrial applications without concerns about overheating.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexible control over the bus signals, enhancing overall system efficiency.

Width: 1.25 mm

Compact size enables space-saving integration in electronic circuit designs, especially where size constraints are a concern.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature tolerance, ensuring reliability in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74LVC1G66GW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74LVC1G66GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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