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V62/12667-01XE

Texas Instruments

V62/12667-01XE by Texas Instruments

V62/12667-01XE by Texas Instruments is a Bus Driver & Transceiver with 10.2 ns Propagation Delay, 8-bit No. of Bits, and 3.3V Power Supplies. It is ideal for military applications due to its MILITARY Temperature Grade, TRUE Output Polarity, and COMMON CONTROL Control Type.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,607 parts In-Stock

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Digiode

USA . 4,866 parts In-Stock

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4,866

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 258 parts In-Stock

1+ parts

$5.035

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258

$5.035

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Andel Nordic

Denmark . 303 parts In-Stock

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$11.187

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$10.739

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$10.739

303

$11.187

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$10.739

$10.739

Parana Technologies

USA . 1,987 parts In-Stock

1+ parts

$15.359

100+ parts

$1,426.291

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$13.823

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$15.359

$1,426.291

$13.823

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DigiPath Technology Company

USA . 1,823 parts In-Stock

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$16.912

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$16.912

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ChromeModa Solutions

Germany . 2,641 parts In-Stock

1+ parts

$17.257

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$14.151

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$17.257

$14.151

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IDEA Electronic Components Group

UK . 411 parts In-Stock

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$17.257

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$16.394

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$15.531

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411

$17.257

$16.394

$15.531

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$18.303

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$17.388

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$17.388

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$18.303

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$17.388

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Corohmni

South Africa . 203 parts In-Stock

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$23.248

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One Stop Electronics

USA . 1,353 parts In-Stock

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$25.000

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$25.000

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Ampacity Inc.

Singapore . 302 parts In-Stock

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$36.000

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$36.000

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Semicontronic

India . 922 parts In-Stock

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$54.000

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$52.650

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$52.380

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922

$54.000

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$52.380

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Argo Parts USA

USA . 3,080 parts In-Stock

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Continental Prestige Electronics

USA . 1,719 parts In-Stock

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Corphita

USA . 1,263 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience top-notch performance and reliability with the V62/12667-01XE by Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceivers device offers exceptional quality and versatility for a wide range of applications. Whether you need to drive or receive signals, this product has got you covered with its advanced features and cutting-edge technology. Trust in Texas Instruments to deliver superior products that will exceed your expectations. Unlock the potential of your projects with the V62/12667-01XE today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and low cost, making it suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 10.2 ns

Fast propagation delay ensures efficient signal transmission.

Surface Mount: YES

Enables easy installation and compact design.

No. of Functions: 2

Having multiple functions allows for versatility and flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage helps in reducing power consumption.

Load Capacitance (CL): 50 pF

Optimal load capacitance for efficient operation.

Power Supplies (V): 3.3

Suitable power supply voltage for stable operation.

No. of Terminals: 48

Sufficient terminals for connectivity and functionality.

Maximum I (ol): 32 Amp

High output current capability for driving bus lines.

Output Characteristics: 3-STATE

3-state output allows for high impedance when not actively driving the bus, reducing interference.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for reliability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers V62/12667-01XE attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

10.2 ns

Propagation Delay (tpd):

27.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

V62/12667-01XE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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