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V62/13602-01XE-T

Texas Instruments

V62/13602-01XE-T by Texas Instruments

V62/13602-01XE-T by Texas Instruments is a Bus Driver & Transceiver with 2 functions, 8 bits, and 3-STATE output. It operates at a nominal voltage of 1.5V with propagation delay of 12.8 ns, suitable for military-grade applications requiring bidirectional control in small outline packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,047 parts In-Stock

1+ parts

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3,047

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Digiode

USA . 1,903 parts In-Stock

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1,903

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,000 parts In-Stock

1+ parts

$8.755

100+ parts

-

1k+ parts

$8.405

10k+ parts

$8.405

1,000

$8.755

-

$8.405

$8.405

Parana Technologies

USA . 267 parts In-Stock

1+ parts

$10.704

100+ parts

-

1k+ parts

$11.191

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267

$10.704

-

$11.191

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DigiPath Technology Company

USA . 358 parts In-Stock

1+ parts

$11.786

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358

$11.786

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ChromeModa Solutions

Germany . 3,228 parts In-Stock

1+ parts

$12.027

100+ parts

$9.862

1k+ parts

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3,228

$12.027

$9.862

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IDEA Electronic Components Group

UK . 1,395 parts In-Stock

1+ parts

$12.027

100+ parts

$11.426

1k+ parts

$10.824

10k+ parts

-

1,395

$12.027

$11.426

$10.824

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AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$17.836

100+ parts

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808

$17.836

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One Stop Electronics

USA . 380 parts In-Stock

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$58.000

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380

$58.000

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Corphita

USA . 768 parts In-Stock

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768

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the V62/13602-01XE-T, a versatile Bus Driver & Transceiver. This product offers seamless integration and exceptional performance in various applications, making it a valuable addition to your projects. With advanced technology and precision engineering, Texas Instruments ensures that you receive top-notch products that exceed expectations. Trust in the V62/13602-01XE-T to deliver superior results and unmatched value for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 12.8 ns

Low propagation delay ensures faster data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability makes installation and assembly easy, saving time and effort during production.

No. of Functions: 2

Having multiple functions in a single component reduces the need for additional components, saving space and cost in the design.

No. of Bits: 8

8 bits allow for a wide range of data transmission and processing capabilities, making this product versatile for various applications.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a low supply voltage of 1.5V helps in reducing power consumption and heat generation, making the product energy efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The ability to operate in extremely low temperatures of -55°C makes this product suitable for a wide range of environments and applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making this product a reliable choice for data transmission.

Technical Specifications

Bus Driver & Transceivers V62/13602-01XE-T attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

12.8 ns

Propagation Delay (tpd):

13.6 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

V62/13602-01XE-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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