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SN74AVC1T45DCKRE4

Texas Instruments

SN74AVC1T45DCKRE4 by Texas Instruments

SN74AVC1T45DCKRE4 by Texas Instruments is a bus driver & transceiver with 5.6 ns propagation delay, operating at 1.5/3.3V supply voltage for bidirectional communication in industrial applications. It features a small outline package with 6 terminals and supports a load capacitance of 15 pF, making it suitable for high-speed data transmission in compact designs.

Median Price

$0.710

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,286 parts In-Stock

1+ parts

$0.710

100+ parts

$0.581

1k+ parts

$0.497

10k+ parts

$0.261

2,286

$0.710

$0.581

$0.497

$0.261

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.314

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$0.314

-

-

-

Digiode

USA . 627 parts In-Stock

1+ parts

$0.665

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$0.665

-

-

-

Chip Stock

USA . 67,160 parts In-Stock

1+ parts

-

100+ parts

-

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67,160

-

-

-

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Vyrian

USA . 8,315 parts In-Stock

1+ parts

-

100+ parts

-

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-

8,315

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,501 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

$0.297

3,501

$0.306

-

-

$0.297

Corohmni

South Africa . 1,164 parts In-Stock

1+ parts

$0.306

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$0.306

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.314

100+ parts

-

1k+ parts

$0.298

10k+ parts

$0.292

50

$0.314

-

$0.298

$0.292

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$0.315

100+ parts

$0.299

1k+ parts

$0.299

10k+ parts

-

450

$0.315

$0.299

$0.299

-

Semicontronic

India . 683 parts In-Stock

1+ parts

$0.590

100+ parts

$0.575

1k+ parts

$0.572

10k+ parts

-

683

$0.590

$0.575

$0.572

-

Ampacity Inc.

Singapore . 490 parts In-Stock

1+ parts

$0.590

100+ parts

-

1k+ parts

-

10k+ parts

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490

$0.590

-

-

-

Corphita

USA . 1,327 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$0.630

-

-

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Continental Prestige Electronics

USA . 1,979 parts In-Stock

1+ parts

$2.975

100+ parts

$2.945

1k+ parts

$2.856

10k+ parts

$2.856

1,979

$2.975

$2.945

$2.856

$2.856

Parana Technologies

USA . 1,646 parts In-Stock

1+ parts

$17.291

100+ parts

-

1k+ parts

$17.505

10k+ parts

-

1,646

$17.291

-

$17.505

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DigiPath Technology Company

USA . 92 parts In-Stock

1+ parts

$19.039

100+ parts

-

1k+ parts

-

10k+ parts

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92

$19.039

-

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ChromeModa Solutions

Germany . 5,537 parts In-Stock

1+ parts

$19.428

100+ parts

$15.931

1k+ parts

-

10k+ parts

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5,537

$19.428

$15.931

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IDEA Electronic Components Group

UK . 896 parts In-Stock

1+ parts

$19.428

100+ parts

$18.457

1k+ parts

$17.485

10k+ parts

-

896

$19.428

$18.457

$17.485

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$19.793

100+ parts

-

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10k+ parts

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573

$19.793

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Microchip USA

USA . 4,961 parts In-Stock

1+ parts

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4,961

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Perfect Parts

USA . 4,815 parts In-Stock

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4,815

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QUARKTWIN TECHNOLOGY LTD

USA . 3,267 parts In-Stock

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3,267

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Overview

Unlock the power of seamless data transmission with the Texas Instruments SN74AVC1T45DCKRE4 bus driver & transceiver. Designed with top-notch quality and cutting-edge technology, this compact device offers reliable signal translation between different voltage levels, making it ideal for a wide range of applications. Benefit from fast propagation delay, low power consumption, and easy surface mount installation. Trust in Texas Instruments' reputation for excellence and choose the SN74AVC1T45DCKRE4 for your next project. Elevate your designs with this versatile and efficient solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 5.6 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication systems.

Surface Mount: YES

Surface mount capability makes installation easy and allows for space-saving on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement and alignment on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.5

Low supply voltage requirement helps in reducing power consumption and heat generation.

Load Capacitance (CL): 15 pF

Suitable load capacitance ensures stable and efficient operation of the product.

Maximum I (ol): 12 Amp

High output current capacity allows the product to drive multiple loads without external amplification.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the product to function reliably in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of connected devices, enabling bus sharing and multi-device communication.

Maximum Power Supply Current (ICC): 0.02 mA

Low power supply current consumption results in energy efficiency and longer battery life in portable applications.

Technical Specifications

Bus Driver & Transceivers SN74AVC1T45DCKRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

5.6 ns

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

1.25 mm

Trade Compliance

SN74AVC1T45DCKRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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