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CLVC1G125MDCKREP

Texas Instruments

CLVC1G125MDCKREP by Texas Instruments

CLVC1G125MDCKREP by Texas Instruments is a 3-STATE bus driver with 4.9 ns propagation delay at 1.8V, suitable for military-grade applications. It has a small outline package with dual terminals and operates in the temperature range of -55 to 125°C, making it ideal for compact electronic systems requiring fast signal transmission.

Median Price

$2.353

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Texas Instruments

USA . 111,849 parts In-Stock

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$1.434

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$1.184

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$0.640

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Chip1Stop

Japan . 317 parts In-Stock

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$2.350

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$1.360

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317

$2.350

$1.360

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Arrow

USA . 1,715 parts In-Stock

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$2.356

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$1.391

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$1.152

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1,715

$2.356

$1.391

$1.152

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DigiKey

USA . 7,748 parts In-Stock

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$2.470

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$1.504

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$1.426

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$1.253

7,748

$2.470

$1.504

$1.426

$1.253

Mouser Electronics

USA . 2,545 parts In-Stock

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$2.470

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$1.510

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$1.430

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$1.230

2,545

$2.470

$1.510

$1.430

$1.230

Verical

USA . 1,715 parts In-Stock

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-

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$1.391

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$1.152

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Distributors (In-Stock)

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Digiode

USA . 913 parts In-Stock

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$0.931

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913

$0.931

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Nova Conductors

Japan . 100 parts In-Stock

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$0.954

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100

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Vyrian

USA . 22,892 parts In-Stock

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Chip Stock

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Q Components

USA . 2,800 parts In-Stock

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Contempo Components LLC

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North Shore Components

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A2Z Electronics, Inc.

USA . 122 parts In-Stock

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Bristol Electronics

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Prism Electronics

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Flex Direct, LLC

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QIE Inc.

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Elcom Components

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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Ampacity Inc.

Singapore . 23,043 parts In-Stock

1+ parts

$0.800

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23,043

$0.800

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Semicontronic

India . 22,538 parts In-Stock

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$0.800

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$0.780

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$0.776

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22,538

$0.800

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$0.776

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Corphita

USA . 3,618 parts In-Stock

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$0.882

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Aranea Global

USA . 100 parts In-Stock

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$0.935

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$0.898

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$0.935

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Continental Prestige Electronics

USA . 4,107 parts In-Stock

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$0.954

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$0.935

4,107

$0.954

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Argo Parts USA

USA . 3,474 parts In-Stock

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$0.954

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Microchip USA

USA . 6,475 parts In-Stock

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$5.604

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Parana Technologies

USA . 252 parts In-Stock

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$9.058

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DigiPath Technology Company

USA . 2,250 parts In-Stock

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$9.974

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$9.176

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ChromeModa Solutions

Germany . 4,249 parts In-Stock

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$10.178

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$8.346

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

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$10.178

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$9.669

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$9.160

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Corohmni

South Africa . 508 parts In-Stock

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$25.904

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$30.415

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$28.894

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Perfect Parts

USA . 62,554 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,660 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

Germany . 4,968 parts In-Stock

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Lixinc

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Akira Global LLC

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Overview

Unlock the potential of your electronic designs with the CLVC1G125MDCKREP from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that guarantee reliable performance. This versatile component is perfect for a wide range of applications, offering customers exceptional value with its low propagation delay and high output current capabilities. Upgrade your projects with the CLVC1G125MDCKREP and experience the benefits of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable construction for the bus driver/transceiver, making it suitable for various applications.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast signal transmission, making the product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount design allows for easy and secure installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage which is energy-efficient and suitable for applications where power consumption is a concern.

Load Capacitance (CL): 50 pF

Optimized load capacitance for stable and efficient signal transmission.

No. of Ports: 2

Supports multiple ports for versatile connectivity options.

Width: 1.25 mm

Small width allows for compact design and integration into space-constrained systems.

Technology: CMOS

CMOS technology ensures low power consumption and reliable operation.

Maximum Supply Voltage (Vsup): 5.5 V

Wide operating voltage range provides flexibility and compatibility with different power sources.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption for energy-efficient performance.

Technical Specifications

Bus Driver & Transceivers CLVC1G125MDCKREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

CLVC1G125MDCKREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-624-3438, 5962016243438

NIIN

016243438

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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