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CLVC373AQDWRG4Q1

Texas Instruments

CLVC373AQDWRG4Q1 by Texas Instruments

CLVC373AQDWRG4Q1 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.5 ns and operates at a nominal voltage of 3.3V. Designed for automotive applications, it features a small outline package, true output polarity, and dual terminal position for efficient signal transmission in vehicles.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,996 parts In-Stock

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Digiode

USA . 2,303 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 82 parts In-Stock

1+ parts

$0.909

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82

$0.909

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Northwest PG Solutions

USA . 599 parts In-Stock

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$1.000

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599

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Andel Nordic

Denmark . 4,464 parts In-Stock

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$3.078

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$2.954

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$2.954

4,464

$3.078

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$2.954

AZTECH Wire

Italy . 225 parts In-Stock

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$10.972

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$10.972

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Parana Technologies

USA . 2,130 parts In-Stock

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$11.009

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$11.470

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$11.009

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$11.470

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DigiPath Technology Company

USA . 2,220 parts In-Stock

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$12.123

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$11.153

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2,220

$12.123

$11.153

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IDEA Electronic Components Group

UK . 1,490 parts In-Stock

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$12.370

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$11.752

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$11.133

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1,490

$12.370

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ChromeModa Solutions

Germany . 1,192 parts In-Stock

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$12.370

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$10.143

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$10.143

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One Stop Electronics

USA . 263 parts In-Stock

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$43.000

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Corphita

USA . 4,489 parts In-Stock

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Microchip USA

USA . 218 parts In-Stock

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Overview

Experience high-quality performance and reliability with the CLVC373AQDWRG4Q1 by Texas Instruments, a cutting-edge Bus Driver & Transceiver. Manufactured by industry leader Texas Instruments, this product offers superior value and benefits for a wide range of applications. With a compact design and advanced technology, this device provides fast propagation delay, true output polarity, and 3-state output characteristics. Ideal for automotive use, this product ensures seamless operation even in extreme temperature conditions. Upgrade your systems with the CLVC373AQDWRG4Q1 and enjoy unmatched efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, making this product reliable for use in various environments.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast signal transmission, making this bus driver/transceiver suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive quality standards, making it a reliable choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle, making this product compatible with standard manufacturing processes.

No. of Bits: 8

With 8 bits, this bus driver/transceiver can handle a wide range of data processing tasks, making it versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a nominal supply voltage of 2.7V makes this product energy-efficient and suitable for low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable signal transmission, making this product reliable for communication purposes.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V provides compatibility with standard voltage levels, making this product easy to integrate into existing systems.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and flexibility in circuit design, making this bus driver/transceiver versatile for different applications.

Technical Specifications

Bus Driver & Transceivers CLVC373AQDWRG4Q1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

CLVC373AQDWRG4Q1 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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