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CLVC1G125MDCKREPG4

Texas Instruments

CLVC1G125MDCKREPG4 by Texas Instruments

CLVC1G125MDCKREPG4 by Texas Instruments is a 3-STATE bus driver with a propagation delay of 4.9 ns at 1.8V, suitable for applications requiring fast signal transmission. It features a load capacitance of 50 pF and operates within a temperature range of -55 to 125°C, making it ideal for military-grade electronics in compact designs. With surface mount capability and dual terminal position, this CMOS technology device offers reliable performance in space-constrained environments.

Median Price

$3.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,570 parts In-Stock

1+ parts

$3.690

100+ parts

$2.010

1k+ parts

$1.370

10k+ parts

$1.140

2,570

$3.690

$2.010

$1.370

$1.140

Distributors (In-Stock)

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Vyrian

USA . 5,167 parts In-Stock

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Component Sense

UK . 2,985 parts In-Stock

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2,985

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Digiode

USA . 2,985 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Andel Nordic

Denmark . 1,532 parts In-Stock

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$5.156

100+ parts

-

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$4.949

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$4.949

1,532

$5.156

-

$4.949

$4.949

Parana Technologies

USA . 813 parts In-Stock

1+ parts

$8.932

100+ parts

$829.475

1k+ parts

$8.039

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-

813

$8.932

$829.475

$8.039

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DigiPath Technology Company

USA . 1,195 parts In-Stock

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$9.835

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$9.835

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ChromeModa Solutions

Germany . 3,150 parts In-Stock

1+ parts

$10.036

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$8.230

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$10.036

$8.230

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IDEA Electronic Components Group

UK . 1,175 parts In-Stock

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$10.036

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$9.534

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$9.032

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$10.036

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$9.032

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AZTECH Wire

Italy . 282 parts In-Stock

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$13.746

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$13.746

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$15.246

100+ parts

$14.484

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$14.484

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$15.246

$14.484

$14.484

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Semicontronic

India . 319 parts In-Stock

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$30.000

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$29.250

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$29.100

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$29.100

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Corohmni

South Africa . 125 parts In-Stock

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$30.241

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One Stop Electronics

USA . 1,102 parts In-Stock

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Ampacity Inc.

Singapore . 976 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Kepictronics

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Continental Prestige Electronics

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Microchip USA

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Corphita

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Infinite Electronics LLP (Excess)

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Argo Parts USA

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Perfect Parts

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Bastille Electronics

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Overview

Experience seamless data transmission with the CLVC1G125MDCKREPG4 by Texas Instruments, a high-quality bus driver and transceiver designed to optimize your electronic systems. Manufactured by industry leader Texas Instruments, this product guarantees reliability and superior performance. Its compact design and low power consumption make it perfect for a wide range of applications. Trust in Texas Instruments to deliver cutting-edge technology that adds exceptional value to your projects. Choose the CLVC1G125MDCKREPG4 for efficient data processing and smooth operations.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material makes the product durable and lightweight, suitable for long-term use in various environments.

Propagation Delay At Nominal Supply:

4.9 ns - Low propagation delay ensures efficient data transmission, making this product ideal for high-speed applications.

Surface Mount:

YES - Being surface mountable makes installation and integration of this product easy and less time-consuming.

Package Shape:

RECTANGULAR - The rectangular shape allows for efficient placement and saves space on the circuit board.

Nominal Supply Voltage / Vsup:

1.8 - The low supply voltage requirement makes this product energy-efficient and cost-effective.

Load Capacitance (CL):

50 pF - Suitable load capacitance ensures stable signal transmission, making this product reliable in different operating conditions.

Power Supplies (V):

3.3 - With multiple power supplies, this product offers flexibility in terms of power input options.

No. of Terminals:

5 - The optimal number of terminals simplifies the connection process and reduces the chances of errors during installation.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This compact package style saves space and makes the product suitable for devices with size constraints.

Maximum I (ol):

32 Amp - The high maximum output current capability ensures compatibility with a wide range of devices and applications.

Output Characteristics:

3-STATE - The 3-state output allows for flexible signal control, enhancing the versatility of this product.

Minimum Operating Temperature:

55 °C - The wide operating temperature range makes this product suitable for use in harsh environments with extreme temperatures.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position:

DUAL - Dual terminal position offers redundancy and enhances the stability of connections, making this product a reliable choice.

No. of Ports:

2 - Having multiple ports allows for versatile connectivity options, making this product suitable for various networking applications.

Maximum Seated Height:

1.1 mm - The low seated height makes this product suitable for slim designs and compact devices.

Width:

1.25 mm - The small width of the product enables easy integration into tight spaces and crowded circuit boards.

Output Polarity:

TRUE - True output polarity ensures accurate signal transmission, reducing the risk of errors in data communication.

Minimum Supply Voltage (Vsup):

1.65 V - The low minimum supply voltage requirement makes this product energy-efficient and compatible with a wide range of systems.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance simplifies the manufacturing process and ensures reliable solder connections.

Length:

2 mm - The compact length of the product allows for space-saving installation in tight layouts and small enclosures.

Temperature Grade:

MILITARY - Military-grade temperature tolerance makes this product suitable for rugged applications and harsh operating conditions.

Technology:

CMOS - CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form:

GULL WING - The gull wing terminal form provides mechanical strength and secure solder joints, ensuring the long-term durability of the product.

Packing Method:

TR - Tape and reel packing method simplifies storage, handling, and automated assembly processes for this product.

Terminal Pitch:

0.65 mm - The small terminal pitch allows for high-density mounting and space-efficient placement on the circuit board.

Count Direction:

UNIDIRECTIONAL - The unidirectional count direction ensures consistent and reliable data transmission in one direction, suitable for specific applications.

Control Type:

ENABLE LOW - The enable low control type offers flexibility in signal activation and deactivation, enhancing the functionality of this product.

Maximum Supply Voltage (Vsup):

5.5 V - With a high maximum supply voltage tolerance, this product is versatile and compatible with a wide range of power sources.

Maximum Power Supply Current (ICC):

0.01 mA - The low maximum power supply current consumption makes this product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Bus Driver & Transceivers CLVC1G125MDCKREPG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.25 mm

Trade Compliance

CLVC1G125MDCKREPG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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