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SN74LVC125ARGYR

Texas Instruments

SN74LVC125ARGYR by Texas Instruments

SN74LVC125ARGYR by Texas Instruments is a 4-function bus driver with a propagation delay of 4.8 ns at 1.8V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and operates on a power supply of 3.3V with surface mount capability.

Median Price

$0.206

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

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Arrow

USA . 140 parts In-Stock

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$0.231

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$0.181

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Texas Instruments

USA . 395,342 parts In-Stock

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Chip1Stop

Japan . 1,913 parts In-Stock

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Verical

USA . 140 parts In-Stock

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$0.181

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$0.156

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$0.156

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Distributors (In-Stock)

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NAC Semi

USA . 1,000 parts In-Stock

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$0.156

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Nova Conductors

Japan . 650 parts In-Stock

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Digiode

USA . 2,078 parts In-Stock

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Vyrian

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Bristol Electronics

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Sea View Technologies

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ComSIT USA

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ComSIT Distribution GmbH

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Semi Source

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Conversion2

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Rebound Electronics

UK . 1,673 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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SPM Sales

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Prism Electronics

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Electronics Depot

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Speed Components Ltd

Israel . 13 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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Semicontronic

India . 74,439 parts In-Stock

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$0.115

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$0.112

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$0.112

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Continental Prestige Electronics

USA . 3,574 parts In-Stock

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$0.178

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$0.174

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Argo Parts USA

USA . 1,920 parts In-Stock

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$0.178

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$0.173

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Aranea Global

USA . 1,000 parts In-Stock

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$0.181

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$0.173

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Corohmni

South Africa . 704 parts In-Stock

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$0.181

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Corphita

USA . 1,822 parts In-Stock

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Ampacity Inc.

Singapore . 74,424 parts In-Stock

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Andel Nordic

Denmark . 3,248 parts In-Stock

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$10.105

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$9.701

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$9.701

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Parana Technologies

USA . 2,119 parts In-Stock

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$27.424

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$35.649

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DigiPath Technology Company

USA . 293 parts In-Stock

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$30.197

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$27.781

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ChromeModa Solutions

Germany . 5,929 parts In-Stock

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$30.813

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$25.267

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IDEA Electronic Components Group

UK . 1,855 parts In-Stock

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Perfect Parts

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Legend Electronics Inc. (Excess)

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Lixinc

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Futuretech Components

Singapore . 478 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Speed Components Ltd (Excess)

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Overview

Elevate your electronic projects with the SN74LVC125ARGYR by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. As part of the Bus Driver & Transceivers category, this versatile chip offers seamless signal transmission, making it ideal for a wide range of applications. With its advanced technology and reliable performance, this product provides exceptional value to customers by delivering fast propagation delay, low power consumption, and precise output characteristics. Upgrade your designs with confidence using the SN74LVC125ARGYR and experience unparalleled efficiency and efficacy.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and resistance to external factors, making the product long-lasting.

Propagation Delay At Nominal Supply: 4.8 ns

Low propagation delay ensures quick signal transmission, resulting in efficient performance.

Surface Mount: YES

Surface mount capability makes installation easier and saves space, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement reduces power consumption and allows for use in low-power applications.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable operation and signal integrity.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, providing flexibility and compatibility with various systems.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various systems, making it a versatile choice.

Technical Specifications

Bus Driver & Transceivers SN74LVC125ARGYR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

4.8 ns

Propagation Delay (tpd):

12.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

SN74LVC125ARGYR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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