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SN74LVC1G125DCKT

Texas Instruments

SN74LVC1G125DCKT by Texas Instruments

SN74LVC1G125DCKT by Texas Instruments is a bus driver with 4.7ns propagation delay, suitable for automotive applications. It operates at 3.3V with 50pF load capacitance and features a 3-STATE output characteristic. This CMOS technology device has a small outline package style and dual terminal position for compact designs.

Median Price

$0.858

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 827,898 parts In-Stock

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$0.815

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$0.554

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Chip1Stop

Japan . 502 parts In-Stock

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Mouser Electronics

USA . 17,213 parts In-Stock

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$0.860

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$0.390

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DigiKey

USA . 5,981 parts In-Stock

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$0.860

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$0.488

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$0.427

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$0.391

5,981

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Element14

Singapore . 94 parts In-Stock

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$1.250

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Arrow

USA . 5,500 parts In-Stock

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$0.397

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Farnell

UK . 94 parts In-Stock

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Freelance Electronics

USA . 13 parts In-Stock

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Nova Conductors

Japan . 34 parts In-Stock

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Digiode

USA . 1,511 parts In-Stock

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DF Sales Co.

USA . 5 parts In-Stock

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DF Sales Co.

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Chip Stock

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Vyrian

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Speed Components Ltd

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North Shore Components

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Bristol Electronics

USA . 1,049 parts In-Stock

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Microfarads

USA . 804 parts In-Stock

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Cyclops Electronics Ltd

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Right Parts Inc.

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Lantek

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Velocity Electronics

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Mil-Aero Solutions, Inc.

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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First Choice Components Inc.

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NAC Semi

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Prism Electronics

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Distributors (Availability)

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Semicontronic

India . 127,251 parts In-Stock

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$0.337

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$0.329

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Argo Parts USA

USA . 3,982 parts In-Stock

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$0.572

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$0.555

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Ampacity Inc.

Singapore . 127,329 parts In-Stock

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$0.730

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Corphita

USA . 1,312 parts In-Stock

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CoreStaff

Japan . 1,000 parts In-Stock

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$1.316

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$0.517

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$0.479

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Microchip USA

USA . 8,036 parts In-Stock

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$4.088

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Parana Technologies

USA . 932 parts In-Stock

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$11.733

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$1,089.575

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$10.560

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Corohmni

South Africa . 157 parts In-Stock

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DigiPath Technology Company

USA . 1,137 parts In-Stock

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$11.886

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ChromeModa Solutions

Germany . 5,116 parts In-Stock

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$13.183

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$10.810

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$13.183

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IDEA Electronic Components Group

UK . 169 parts In-Stock

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$13.183

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$12.524

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$11.865

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Modulus Dynamics

Lithuania . 3,444 parts In-Stock

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$16.765

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$16.765

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$16.765

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$16.765

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$29.753

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$28.265

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$28.265

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$29.753

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Continental Prestige Electronics

USA . 105 parts In-Stock

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$227.640

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$225.370

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$218.540

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$218.540

105

$227.640

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$218.540

Andel Nordic

Denmark . 3,963 parts In-Stock

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$227.644

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$218.538

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Perfect Parts

USA . 30,213 parts In-Stock

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Lixinc

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Robosynatics

Brazil . 2,922 parts In-Stock

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Lucentia Tech

USA . 2,922 parts In-Stock

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$13.596

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$13.318

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$13.318

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Netroflash

USA . 50 parts In-Stock

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$0.561

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$0.543

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$0.532

50

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$0.532

Overview

Unlock seamless data transmission with the SN74LVC1G125DCKT by Texas Instruments. Designed with precision and reliability in mind, this bus driver & transceiver offers unparalleled performance for a wide range of applications. Its advanced features, including 3-state output characteristics and true output polarity, ensure optimal signal integrity and efficiency. With a compact design and a wide operating temperature range, this high-quality component is a must-have for any project where space-saving and reliable data communication are essential. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Elevate your designs with the SN74LVC1G125DCKT and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a suitable choice for rugged environments.

Propagation Delay At Nominal Supply: 4.7 ns

With a low propagation delay, this product ensures efficient data transmission and fast response times.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB, ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into existing board layouts, making it a convenient choice for retrofitting.

Nominal Supply Voltage / Vsup: 3.3V

Operating at a standard voltage level of 3.3V ensures compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and improving overall signal integrity.

Power Supplies (V): 3.3V

Having a single power supply simplifies the design and reduces component count, making it an efficient choice.

No. of Terminals: 5

The optimal number of terminals provides a balance between functionality and ease of connection, making it user-friendly.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact footprint while maintaining excellent performance, perfect for space-constrained applications.

Maximum I (ol): 32 Amp

With a high maximum output current, this product can drive loads with ease, making it versatile in various applications.

Propagation Delay (tpd): 9 ns

The low propagation delay ensures minimal signal delay, enhancing the overall speed and efficiency of the system.

Maximum Operating Temperature: 125 °C

Operating at high temperatures without compromising performance makes it suitable for demanding environments.

Output Characteristics: 3-STATE

The 3-STATE output allows for flexible control of the bus line, enabling multi-drop configurations and reducing power consumption.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product can function reliably in extreme conditions, making it versatile.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, increasing product longevity.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connectivity, enhancing the reliability of the connection.

No. of Ports: 2

Having two ports allows for dual-channel communication, expanding the functionality and versatility of the product.

Maximum Seated Height: 1.1 mm

The low profile design saves space on the PCB, making it suitable for compact designs with height constraints.

Width: 1.25 mm

The narrow width allows for efficient use of board space, making it ideal for densely populated PCBs.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, simplifying integration in digital systems.

Minimum Supply Voltage (Vsup): 1.65V

The low minimum supply voltage provides flexibility in power supply selection while ensuring reliable operation.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the reflow soldering process, ensuring robust assembly.

Length: 2 mm

The compact length of the package saves space on the PCB, making it ideal for designs with size constraints.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent requirements for reliability and durability in harsh environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering during assembly, ensuring a strong and reliable connection.

Packing Method: TR

The TR packing method provides convenience and protection during shipping and handling, ensuring product integrity.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting, making it suitable for miniaturized designs.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies system design and operation, ensuring straightforward compatibility.

Control Type: ENABLE LOW

The enable low control type offers a user-friendly interface for managing the device, enhancing ease of use.

Maximum Supply Voltage (Vsup): 5.5V

With a high maximum supply voltage, this product can withstand voltage spikes and variations, ensuring robust performance.

Maximum Power Supply Current (ICC): 0.01 mA

Operating with a low power supply current minimizes power consumption, making it energy-efficient and cost-effective.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCKT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCKT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-618-4952, 5962016184952

NIIN

016184952

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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