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SN54LS374J

Texas Instruments

SN54LS374J by Texas Instruments

SN54LS374J by Texas Instruments is an 8-bit bus driver with a propagation delay of 28ns at 5V. It features a 3-STATE output and operates in a temperature range from -55 to 125°C. Ideal for applications requiring true output polarity and positive edge triggering, such as military-grade systems.

Median Price

$10.947

Lifecycle Status

Suppliers In-Stock

51

In-Stock Inventory

1k+

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Arrow

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TEDSS.com

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Freelance Electronics

USA . 67 parts In-Stock

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$10.187

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Component Electronics Inc.

Canada . 5 parts In-Stock

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NAC Semi

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Parana Technologies

USA . 1,918 parts In-Stock

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$7.772

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$8.317

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One Stop Electronics

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$8.090

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

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$8.733

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$8.296

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$7.860

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ChromeModa Solutions

Germany . 802 parts In-Stock

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$8.733

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$7.161

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Semicontronic

India . 40 parts In-Stock

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$9.300

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$9.068

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AZTECH Wire

Italy . 514 parts In-Stock

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$26.900

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Andel Nordic

Denmark . 5,771 parts In-Stock

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Lixinc

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Overview

Unlock the power of seamless data transmission with the SN54LS374J from Texas Instruments. Crafted with precision and reliability in mind, this bus driver & transceiver is designed to meet the highest standards of quality and performance. Ideal for a wide range of applications, this product offers customers unparalleled value with its fast propagation delay, high output current, and true output polarity. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and enhances your projects. Experience the difference with the SN54LS374J today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides high reliability and protection for the internal components of the bus driver, ensuring long-term performance and durability.

No. of Bits: 8

Having 8 bits allows for greater data transmission capabilities and versatility in communication protocols, making this bus driver suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems and simplifies integration into existing setups.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this bus driver can withstand harsh environmental conditions without compromising performance, making it suitable for industrial and automotive applications.

Technology: TTL

Utilizing TTL technology ensures fast and reliable signal processing, making this bus driver ideal for applications requiring high-speed data transmission and low signal distortion.

Technical Specifications

Bus Driver & Transceivers SN54LS374J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LS

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

SN54LS374J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-102-3114, 5962011023114, 5962-01-125-3107, 5962011253107, 5962-01-131-5242, 5962011315242, 5962-01-180-5309, 5962011805309, 5962-01-344-1901, 5962013441901

NIIN

011023114, 011253107, 011315242, 011805309, 013441901

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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