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SN74HCT244PWRE4

Texas Instruments

SN74HCT244PWRE4 by Texas Instruments

SN74HCT244PWRE4 by Texas Instruments is a 2-function bus driver & transceiver with a propagation delay of 35 ns and a load capacitance of 50 pF. It is commonly used in industrial applications due to its small outline, thin profile package style and industrial temperature grade.

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1k+

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Chip Stock

USA . 85,580 parts In-Stock

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Vyrian

USA . 7,680 parts In-Stock

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7,680

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Digiode

USA . 3,804 parts In-Stock

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Nova Conductors

Japan . 46 parts In-Stock

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Andel Nordic

Denmark . 3,731 parts In-Stock

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$4.912

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$4.715

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$4.715

3,731

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$4.715

AZTECH Wire

Italy . 665 parts In-Stock

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$9.319

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665

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Parana Technologies

USA . 743 parts In-Stock

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$14.493

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$1,345.873

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$13.043

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One Stop Electronics

USA . 1,572 parts In-Stock

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$15.000

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DigiPath Technology Company

USA . 1,312 parts In-Stock

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$15.958

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$14.682

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ChromeModa Solutions

Germany . 292 parts In-Stock

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$16.284

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$13.353

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IDEA Electronic Components Group

UK . 259 parts In-Stock

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$15.470

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$14.656

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Corohmni

South Africa . 383 parts In-Stock

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Ampacity Inc.

Singapore . 571 parts In-Stock

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Semicontronic

India . 1,136 parts In-Stock

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$54.000

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$52.650

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Continental Prestige Electronics

USA . 3,001 parts In-Stock

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Corphita

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Australia . 750 parts In-Stock

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Overview

Discover the SN74HCT244PWRE4 by Texas Instruments, a high-quality bus driver and transceiver that offers exceptional value and benefits. Manufactured by Texas Instruments, a renowned industry leader, this product ensures reliability and superior performance. Its versatile applications make it an essential component for various electronic systems. With its true output polarity and 3-STATE characteristics, the SN74HCT244PWRE4 guarantees seamless integration and efficient signal transmission. Experience the advantages of this compact and durable device, designed to meet industrial standards and withstand extreme temperatures. Don't miss out on the opportunity to enhance your electronic projects with the SN74HCT244PWRE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of high-quality plastic/epoxy material, ensuring durability and protection for the internal components.

Propagation Delay At Nominal Supply: 35 ns

With a fast propagation delay of 35 ns, this product provides efficient and reliable transmission of signals, making it ideal for bus driver and transceiver applications.

Surface Mount: YES

This product is designed for surface mount assembly, allowing for easier and more convenient installation onto circuit boards.

No. of Functions: 2

Offering two functions in a single package, this product provides versatility and cost-effectiveness for bus driver and transceiver applications.

Package Shape: RECTANGULAR

The rectangular shape of this package ensures efficient use of space on circuit boards, making it a practical choice for compact designs.

No. of Bits: 4

With four bits of data handling capability, this product allows for efficient communication and data transmission in bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product is compatible with standard power supply configurations, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product can effectively drive capacitive loads, ensuring reliable and efficient signal transmission.

Power Supplies (V): 5

The 5V power supply capability of this product ensures compatibility with standard power configurations, making it a reliable and convenient choice for bus driver and transceiver applications.

No. of Terminals: 20

Featuring 20 terminals, this product allows for easy connection and integration into circuit designs, providing flexibility and convenience.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style of this product offer space-saving advantages, making it suitable for compact designs and applications with limited board real estate.

Maximum I (ol): 6 Amp

With a maximum output current of 6 Amps, this product can handle high current requirements, ensuring robust and reliable performance in bus driver and transceiver applications.

Propagation Delay (tpd): 56 ns

With a propagation delay of 56 ns, this product provides efficient and timely signal transmission, allowing for smooth data flow in bus driver and transceiver applications.

Maximum Operating Temperature: 85 °C

Operating up to a maximum temperature of 85°C, this product can withstand high-temperature environments, ensuring reliable performance in various operating conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this product allow for tri-state operation, providing flexibility and control in bus driver and transceiver applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can function reliably in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish of this product offers excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

Featuring dual terminal positions, this product enables versatile connection options, enhancing flexibility in bus driver and transceiver applications.

No. of Ports: 2

This product provides two ports, allowing for simultaneous communication and data transmission between multiple devices, making it highly suitable for bus driver and transceiver applications.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this product has a low-profile design, making it suitable for space-constrained applications and facilitating efficient board layouts.

Width: 4.4 mm

With a width of 4.4 mm, this product offers a compact form factor, allowing for more efficient utilization of space in circuit designs.

Output Polarity: TRUE

The true output polarity of this product ensures accurate signal representation, making it reliable for bus driver and transceiver applications.

Minimum Supply Voltage (Vsup): 4.5 V

Operating at a minimum supply voltage of 4.5V, this product can function with lower power requirements, providing energy-efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product can withstand the reflow soldering process, facilitating reliable and efficient manufacturing processes.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring secure connections and reliable performance.

Length: 6.5 mm

With a length of 6.5 mm, this product offers a compact and space-saving design, enabling efficient board layouts and integration into various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range, this product can operate reliably in harsh environments, making it suitable for industrial bus driver and transceiver applications.

Technology: CMOS

Built using CMOS technology, this product provides low-power consumption, high noise immunity, and efficient operation, making it a reliable choice for bus driver and transceiver applications.

Terminal Form: GULL WING

Featuring a gull-wing terminal form, this product allows for reliable and secure soldering connections, ensuring long-term performance in bus driver and transceiver applications.

Packing Method: TR

Packaged in tape and reel format, this product offers convenient handling, protection during transportation, and easy pick-and-place for automated assembly processes.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this product provides fine-pitch connections, facilitating compact designs and higher-density PCB layouts.

Control Type: ENABLE LOW

Incorporating an enable low control type, this product offers easy and precise control over its operation, enhancing flexibility and compatibility with various bus driver and transceiver configurations.

Moisture Sensitivity Level (MSL): 1

This product has a moisture sensitivity level of 1, indicating that it has unlimited shelf life in sealed moisture barrier bags, ensuring long-term storage and reliability.

Maximum Supply Voltage (Vsup): 5.5 V

Operating at a maximum supply voltage of 5.5V, this product can handle higher voltage requirements, making it suitable for a wide range of bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers SN74HCT244PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

56 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74HCT244PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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