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SN74LVC1G125DCKRG4

Texas Instruments

SN74LVC1G125DCKRG4 by Texas Instruments

SN74LVC1G125DCKRG4 by Texas Instruments is a 3.3V bus driver with 4.5ns propagation delay, suitable for industrial applications. It features a 50pF load capacitance, operates b/w -40 to 85°C, and has a max I (ol) of 24Amp. This CMOS technology device comes in a small outline package with dual terminals and true output polarity.

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Vyrian

USA . 7,457 parts In-Stock

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Zilex Electronics Inc.

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Bristol Electronics

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Nova Conductors

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One Stop Electronics

USA . 621 parts In-Stock

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AZTECH Wire

Italy . 709 parts In-Stock

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Corohmni

South Africa . 45 parts In-Stock

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Parana Technologies

USA . 2,174 parts In-Stock

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$18.708

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$18.800

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DigiPath Technology Company

USA . 2,113 parts In-Stock

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ChromeModa Solutions

Germany . 5,299 parts In-Stock

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IDEA Electronic Components Group

UK . 711 parts In-Stock

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Semicontronic

India . 574 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Ampacity Inc.

Singapore . 1,367 parts In-Stock

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Andel Nordic

Denmark . 3,602 parts In-Stock

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Continental Prestige Electronics

USA . 499 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the SN74LVC1G125DCKRG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The SN74LVC1G125DCKRG4 falls under the category of Bus Driver & Transceivers, offering fast propagation delay and low power consumption. With a compact package and a wide operating temperature range, this product is perfect for a variety of applications. Trust in Texas Instruments to provide you with the value, benefits, and advantages you need for your next project. Upgrade your designs today with the SN74LVC1G125DCKRG4.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, ensuring long-lasting performance.

Propagation Delay At Nominal Supply 4.5 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount YES

Surface mount capability makes installation and assembly easier, saving time and effort during production.

Nominal Supply Voltage / Vsup (V) 3.3

Optimal supply voltage of 3.3V ensures efficient power usage and compatibility with standard power sources.

Load Capacitance (CL) 50 pF

The load capacitance of 50 pF ensures stable and smooth signal transmission, preventing signal distortion or interference.

Maximum I (ol) 24 Amp

High output current capability of 24 Amp allows for driving larger loads or multiple components, increasing the product's versatility.

Output Characteristics 3-STATE

3-STATE output characteristics provide flexibility in controlling the output signal, allowing for tri-state logic operation and improved signal management.

Minimum Operating Temperature -40 °C

Wide operating temperature range of -40 to 85°C ensures performance in various environmental conditions, making this product suitable for industrial applications.

Technology CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCKRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCKRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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