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SN74ALVC164245DGGR

Texas Instruments

SN74ALVC164245DGGR by Texas Instruments

SN74ALVC164245DGGR by Texas Instruments is a bus driver & transceiver with 8 bits, 3V & 5V translation, and 2 functions. It has a propagation delay of 5.8 ns, operates at temperatures from -40 to 85 °C, and supports common control applications in industrial settings.

Median Price

$2.469

Lifecycle Status

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43

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1k+

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Arrow

USA . 1,643 parts In-Stock

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Chip1Stop

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Mouser Electronics

USA . 597 parts In-Stock

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Newark

USA . 248 parts In-Stock

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Element14

Singapore . 248 parts In-Stock

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UK . 3,680 parts In-Stock

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Verical

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Farnell

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EXC GmbH

Germany . 1,471 parts In-Stock

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Maritex

Poland . 2 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Component Electronics Inc.

Canada . 23 parts In-Stock

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TEDSS.com

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Semicontronic

India . 5,947 parts In-Stock

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$0.940

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$0.916

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$0.912

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Ampacity Inc.

Singapore . 5,689 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 2,140 parts In-Stock

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Netroflash

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Modulus Dynamics

Lithuania . 22 parts In-Stock

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$1.465

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$1.451

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$1.407

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Corphita

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Allen Electronics Distributors

USA . 1,790 parts In-Stock

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Andel Nordic

Denmark . 2,454 parts In-Stock

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$6.440

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$6.182

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Parana Technologies

USA . 1,246 parts In-Stock

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$9.810

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DigiPath Technology Company

USA . 2,357 parts In-Stock

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$10.802

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$9.937

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ChromeModa Solutions

Germany . 3,420 parts In-Stock

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$11.022

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$9.038

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IDEA Electronic Components Group

UK . 149 parts In-Stock

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$11.022

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$10.471

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Corohmni

South Africa . 178 parts In-Stock

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$15.994

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$35.006

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$35.006

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Perfect Parts

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Fairview Electronics Ltd

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Overview

Enhance your digital designs with the SN74ALVC164245DGGR by Texas Instruments, a top-quality Bus Driver & Transceiver that guarantees reliable performance. With a reputation for excellence, Texas Instruments delivers cutting-edge technology and innovation in every product. This versatile component offers seamless translation between 3V and 5V systems, making it ideal for a wide range of applications. Experience the value of faster propagation delay, low power consumption, and compact design, all packed into this 8-bit transceiver. Upgrade your projects with the SN74ALVC164245DGGR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Makes the product lightweight and durable.

Propagation Delay At Nominal Supply

5.8 ns - Provides fast response time for efficient data transmission.

Surface Mount

YES - Allows for easy and compact installation on circuit boards.

No. of Functions

2 - Offers versatility in functionality for different applications.

Package Shape

RECTANGULAR - Facilitates efficient placement and organization on a circuit board.

No. of Bits

8 - Provides sufficient data capacity for various communication needs.

Translation

3V & 5V - Ensures compatibility with different voltage requirements.

Nominal Supply Voltage / Vsup (V)

2.7 - Offers a stable power supply for consistent performance.

Load Capacitance (CL)

50 pF - Enhances signal integrity and reduces distortion.

Power Supplies (V)

3.3,5 - Allows for flexibility in power options based on requirements.

No. of Terminals

48 - Provides ample connection points for seamless integration.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enables compact and efficient design in tight spaces.

Maximum I (ol)

24 Amp - Supports high current output for demanding applications.

Propagation Delay (tpd)

7.6 ns - Ensures quick data transmission for efficient operation.

Maximum Operating Temperature

85 °C - Allows for reliable performance in various environments.

Output Characteristics

3-STATE - Offers flexibility in signal output options.

Minimum Operating Temperature

40 °C - Functions reliably even in low-temperature conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Provides corrosion resistance and ensures long-term durability.

Terminal Position

DUAL - Allows for versatile mounting options on a circuit board.

No. of Ports

2 - Enables multiple connections for enhanced functionality.

Maximum Seated Height

1.2 mm - Contributes to a slim and compact overall design.

Width

6.1 mm - Facilitates easy integration in tight spaces.

Output Polarity

TRUE - Provides accurate and consistent signal output.

Minimum Supply Voltage (Vsup)

2.5 V - Ensures reliable performance even at lower voltage levels.

Technical Specifications

Bus Driver & Transceivers SN74ALVC164245DGGR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V TO 5.5V SUPPLY FOR PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

6.1 mm

Trade Compliance

SN74ALVC164245DGGR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-549-3662, 5962015493662

NIIN

015493662

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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