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SN74CB3T1G125DBVR

Texas Instruments

SN74CB3T1G125DBVR by Texas Instruments

SN74CB3T1G125DBVR by Texas Instruments is a 5-terminal bus driver with 0.25 ns propagation delay at 2.5V, suitable for industrial applications. It features a small outline package style, operates b/w -40 to 85 °C, and supports bidirectional communication with true output polarity.

Median Price

$0.550

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 198 parts In-Stock

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$0.791

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$0.556

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$0.526

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$0.515

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$0.515

Texas Instruments

USA . 190,035 parts In-Stock

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DigiKey

USA . 126,522 parts In-Stock

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$0.560

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Rochester

USA . 123,322 parts In-Stock

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$0.762

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$0.633

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$0.633

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Mouser Electronics

USA . 3,706 parts In-Stock

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$0.487

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Arrow

USA . 3,000 parts In-Stock

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$0.475

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$0.475

Verical

USA . 1,486 parts In-Stock

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$0.485

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$0.471

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Chip1Stop

Japan . 1,341 parts In-Stock

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Farnell

UK . 127 parts In-Stock

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$0.540

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$0.431

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$0.399

127

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$0.399

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$0.402

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$0.402

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Digiode

USA . 605 parts In-Stock

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$0.515

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605

$0.515

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Component Electronics Inc.

Canada . 22 parts In-Stock

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$0.770

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$0.580

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$0.500

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22

$0.770

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Vyrian

USA . 49,525 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 16,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,070 parts In-Stock

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Sea View Technologies

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ACDS - Activité Composants Distribution Service

France . 2,595 parts In-Stock

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Bristol Electronics

USA . 2,595 parts In-Stock

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Dan-Mar Components

USA . 2,595 parts In-Stock

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Zilex Electronics Inc.

Canada . 1,319 parts In-Stock

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PC Components Company LLC

USA . 49 parts In-Stock

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Semi Source

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Distributors (Availability)

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Ampacity Inc.

Singapore . 49,761 parts In-Stock

1+ parts

$0.225

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$0.225

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Argo Parts USA

USA . 1,739 parts In-Stock

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$0.374

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$0.362

1,739

$0.374

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Corohmni

South Africa . 425 parts In-Stock

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$0.388

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$0.400

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$0.380

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$0.380

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Semicontronic

India . 49,860 parts In-Stock

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$0.404

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$0.394

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$0.392

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Corphita

USA . 2,304 parts In-Stock

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$0.488

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Andel Nordic

Denmark . 5,538 parts In-Stock

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$2.218

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$2.129

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Microchip USA

USA . 3,802 parts In-Stock

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$2.456

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Parana Technologies

USA . 266 parts In-Stock

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$19.326

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$19.347

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DigiPath Technology Company

USA . 1,667 parts In-Stock

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$21.281

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$19.578

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$21.281

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ChromeModa Solutions

Germany . 5,918 parts In-Stock

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$21.715

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$17.806

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IDEA Electronic Components Group

UK . 2,227 parts In-Stock

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$21.715

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$20.629

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$19.544

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Perfect Parts

USA . 50,567 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 24,020 parts In-Stock

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A-Z Elektronik GmbH

Germany . 12,210 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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GreenTree Electronics

Israel . 5,560 parts In-Stock

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Continental Prestige Electronics

USA . 1,422 parts In-Stock

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$0.368

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$0.279

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Netroflash

USA . 50 parts In-Stock

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$0.394

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$0.382

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$0.374

50

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$0.394

$0.382

$0.374

Overview

Experience seamless data transmission and reliable performance with the SN74CB3T1G125DBVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and precision engineering in every product. Ideal for Bus Driver & Transceivers applications, this small outline, low profile package offers a quick propagation delay of 0.25 ns and 3-state output characteristics. With a wide temperature range and dual terminal position, this versatile component provides unmatched value and efficiency for your projects. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it ideal for portable devices such as buses.

Propagation Delay At Nominal Supply: 0.25 ns

Low propagation delay ensures fast data transmission, making this product efficient for real-time applications in bus communication systems.

Surface Mount: YES

Surface mount design allows for easy and convenient installation, saving space on PCBs and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard voltage of 2.5V, making it compatible with common bus system power supplies.

No. of Ports: 2

Having multiple ports allows for simultaneous communication with multiple devices, increasing the versatility of this product in bus networks.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions inside a bus without performance degradation.

Output Characteristics: 3-STATE

3-state output allows for the driver to be in an active, high-impedance, or disabled state, providing flexibility in controlling the bus signals.

Technical Specifications

Bus Driver & Transceivers SN74CB3T1G125DBVR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3T/3VT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

1.6 mm

Trade Compliance

SN74CB3T1G125DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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