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SN74LVC1G125DCKRE4

Texas Instruments

SN74LVC1G125DCKRE4 by Texas Instruments

SN74LVC1G125DCKRE4 by Texas Instruments is a bus driver with 3.3V supply voltage, 4.5ns propagation delay, and 50pF load capacitance. It is ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,974 parts In-Stock

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Digiode

USA . 443 parts In-Stock

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Nova Conductors

Japan . 63 parts In-Stock

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AZTECH Wire

Italy . 707 parts In-Stock

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$6.198

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707

$6.198

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Corohmni

South Africa . 97 parts In-Stock

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$10.174

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Parana Technologies

USA . 1,483 parts In-Stock

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$10.339

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$10.860

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$10.339

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$10.874

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$10.330

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$10.330

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40

$10.874

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$10.330

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DigiPath Technology Company

USA . 1,543 parts In-Stock

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$11.385

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$10.474

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ChromeModa Solutions

Germany . 2,101 parts In-Stock

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$11.617

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$9.526

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IDEA Electronic Components Group

UK . 1,925 parts In-Stock

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$11.617

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$11.036

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$10.455

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Ampacity Inc.

Singapore . 454 parts In-Stock

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$30.000

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One Stop Electronics

USA . 327 parts In-Stock

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Semicontronic

India . 555 parts In-Stock

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$57.230

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Continental Prestige Electronics

USA . 400 parts In-Stock

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$202.610

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$200.580

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$194.510

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$194.510

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$202.610

$200.580

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$194.510

Andel Nordic

Denmark . 2,504 parts In-Stock

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$202.610

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$194.506

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$194.506

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Perfect Parts

USA . 14,887 parts In-Stock

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Argo Parts USA

USA . 2,595 parts In-Stock

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Corphita

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Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$0.611

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Bastille Electronics

Australia . 93 parts In-Stock

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Modulus Dynamics

Lithuania . 15 parts In-Stock

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Overview

Elevate your electronic designs with the SN74LVC1G125DCKRE4 by Texas Instruments, a leading manufacturer known for its top-quality products. As a versatile Bus Driver & Transceiver, this component offers fast propagation delay at nominal supply, 3-state output characteristics, and a compact package design. Perfect for industrial applications, this device operates efficiently at temperatures ranging from -40 to 85°C. Experience seamless integration and enhanced performance with the SN74LVC1G125DCKRE4, providing unmatched value and reliability for all your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 4.5 ns

Fast propagation delay ensures quick and efficient data transmission within the bus driver & transceivers.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

Optimal load capacitance ensures stability and reliable performance of the product.

Power Supplies (V): 3.3

Consistent power supply ensures reliable and stable operation of the bus driver & transceivers.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and slim design saves space on the circuit board and allows for efficient layout of components.

Maximum I (ol): 24 Amp

High output current capability allows for driving of heavy loads, making the product versatile in various applications.

Propagation Delay (tpd): 9 ns

Low propagation delay ensures fast signal transmission, reducing latency and improving overall system performance.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable operation in different environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, preventing conflicts on the bus.

Minimum Operating Temperature: -40 °C

Can still operate in extreme cold conditions, ensuring reliability in harsh environments.

No. of Ports: 2

Dual ports provide flexibility for connecting multiple devices, enhancing connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G125DCKRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G125DCKRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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