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SN74LVC1G373DCKRG4

Texas Instruments

SN74LVC1G373DCKRG4 by Texas Instruments

SN74LVC1G373DCKRG4 by Texas Instruments is a 3-STATE bus driver with 16.3 ns propagation delay, suitable for industrial applications. It operates b/w -40 to 85 °C with a supply voltage range of 1.65V to 5.5V, featuring a small outline package style and dual terminal position.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

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$1.000

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$1.000

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Vyrian

USA . 4,478 parts In-Stock

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Digiode

USA . 2,067 parts In-Stock

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2,067

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Prism Electronics

USA . 23 parts In-Stock

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Continental Prestige Electronics

USA . 4,382 parts In-Stock

1+ parts

$1.000

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$0.980

4,382

$1.000

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$0.980

Argo Parts USA

USA . 1,387 parts In-Stock

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$1.000

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$1.000

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Andel Nordic

Denmark . 1,714 parts In-Stock

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$2.287

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$2.195

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$2.195

1,714

$2.287

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$2.195

$2.195

Parana Technologies

USA . 306 parts In-Stock

1+ parts

$7.326

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-

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$7.819

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306

$7.326

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$7.819

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DigiPath Technology Company

USA . 522 parts In-Stock

1+ parts

$8.067

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522

$8.067

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ChromeModa Solutions

Germany . 1,558 parts In-Stock

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$8.232

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$6.750

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IDEA Electronic Components Group

UK . 237 parts In-Stock

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$8.232

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$7.409

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237

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AZTECH Wire

Italy . 691 parts In-Stock

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$15.999

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691

$15.999

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Ampacity Inc.

Singapore . 457 parts In-Stock

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$21.000

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457

$21.000

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Semicontronic

India . 861 parts In-Stock

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$27.000

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$26.325

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$26.190

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861

$27.000

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$26.190

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Aztec Data Supply Inc.

USA . 8,210 parts In-Stock

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$32.903

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$32.903

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One Stop Electronics

USA . 195 parts In-Stock

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$34.000

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195

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Corphita

USA . 4,489 parts In-Stock

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4,489

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Microchip USA

USA . 2,480 parts In-Stock

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2,480

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Modulus Dynamics

Lithuania . 61 parts In-Stock

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Overview

Unlock seamless data transmission with the SN74LVC1G373DCKRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus driver & transceiver is perfect for a wide range of applications, offering customers unparalleled value and benefits. Experience fast propagation delay, 3-state output characteristics, and industrial-grade performance with the SN74LVC1G373DCKRG4. Trust Texas Instruments to deliver cutting-edge technology for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the device easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Nominal Supply Voltage: 1.8V

Operating at a low supply voltage of 1.8V helps to conserve power and extend battery life in portable devices.

Propagation Delay: 16.3 ns

Fast propagation delay of 16.3 ns ensures quick data transmission and high-speed performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable operation in a wide range of environments.

Output Characteristics: 3-STATE

3-STATE output allows for high level of flexibility in controlling the output signal, enhancing versatility of the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G373DCKRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

16.3 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

SN74LVC1G373DCKRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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