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SN74LVC541ADBR

Texas Instruments

SN74LVC541ADBR by Texas Instruments

SN74LVC541ADBR by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.1 ns at 3.3V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and a terminal pitch of 0.65 mm.

Median Price

$0.429

Lifecycle Status

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28

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1k+

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Adafruit Industries

USA . 450 parts In-Stock

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Texas Instruments

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Arrow

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Chip1Stop

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Mouser Electronics

USA . 3,324 parts In-Stock

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Rochester

USA . 73,054 parts In-Stock

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DigiKey

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Verical

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Digiode

USA . 766 parts In-Stock

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Nova Conductors

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Forefront Electronics and Design

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DigiKey Marketplace

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Vyrian

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Chip Stock

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Bristol Electronics

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Atlantic Semiconductor

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QIE Inc.

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Electro Mavin

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Cyclops Electronics Ltd

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Sensible Micro Corp

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Tectiva GmbH

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PC Components Company LLC

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Inventory MP

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Mil-Aero Solutions, Inc.

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LWI Electronics Inc

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Sunrise Surplus Inc.

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Ampacity Inc.

Singapore . 31,291 parts In-Stock

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Semicontronic

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Corphita

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Component Stockers USA

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Corohmni

South Africa . 201 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Argo Parts USA

USA . 4,784 parts In-Stock

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Netroflash

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Continental Prestige Electronics

USA . 397 parts In-Stock

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Andel Nordic

Denmark . 2,757 parts In-Stock

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$8.536

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$8.536

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Parana Technologies

USA . 1,885 parts In-Stock

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$28.748

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$51.347

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DigiPath Technology Company

USA . 1,678 parts In-Stock

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ChromeModa Solutions

Germany . 4,103 parts In-Stock

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IDEA Electronic Components Group

UK . 1,487 parts In-Stock

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Perfect Parts

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Lucentia Tech

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Overview

Enhance your electronic designs with the SN74LVC541ADBR by Texas Instruments, a top-notch Bus Driver & Transceiver crafted with precision and quality. This versatile component offers lightning-fast propagation delay, low power consumption, and a wide temperature range, making it ideal for automotive applications. With Texas Instrument's reputation for excellence in manufacturing, you can trust that this product delivers unrivaled performance and reliability. Elevate your projects with the SN74LVC541ADBR and experience the difference in quality and efficiency it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Propagation Delay At Nominal Supply: 5.1 ns

The low propagation delay ensures fast signal transmission, improving overall efficiency.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape makes the product compatible with standard packaging and easy to integrate into existing systems.

No. of Bits: 8

The 8-bit design provides sufficient data transmission capabilities for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in many systems, offering compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and improving signal integrity.

Power Supplies (V): 3.3

The availability of a 3.3V power supply ensures consistent performance in different voltage environments.

No. of Terminals: 20

The ample number of terminals allows for versatile connectivity options in complex systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design save space on the PCB, making it suitable for compact designs.

Maximum I (ol): 24 Amp

The high output current rating enables the product to drive heavy loads without overheating or performance degradation.

Propagation Delay (tpd): 15.7 ns

The moderate propagation delay allows for reliable and efficient data transmission within the system.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures the product's reliability in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output feature provides flexibility in controlling the bus lines, enhancing system functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes the product suitable for use in diverse climatic conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold finish protects the terminals from corrosion and ensures long-term reliability.

Terminal Position: DUAL

The dual terminal position design offers redundancy and improved signal integrity in complex systems.

No. of Ports: 2

Having 2 ports allows for increased connectivity options and data exchange capabilities.

Maximum Seated Height: 2 mm

The low seated height ensures compatibility with slim profile applications and saves space on the PCB.

Width: 5.3 mm

The compact width dimensions enable easy integration into tight spaces or densely populated PCB layouts.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation, reducing the risk of errors in data transmission.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement allows for operation in energy-efficient systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering during assembly processes.

Length: 7.2 mm

The moderate length dimensions offer a balanced form factor for easy handling and PCB integration.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures reliability and performance in demanding vehicular environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and enhances mechanical strength during assembly.

Packing Method: TR

The TR packing method ensures safe and organized handling during shipping and storage.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density mounting and efficient use of PCB real estate.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies data flow management and reduces the risk of errors.

Control Type: ENABLE LOW

The enable low control type offers easy configuration and operation in various control schemes.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage tolerance adds flexibility to the product's compatibility with different power sources.

Maximum Power Supply Current (ICC): 0.01 mA

The low power supply current requirement contributes to energy efficiency and prolonged battery life.

Technical Specifications

Bus Driver & Transceivers SN74LVC541ADBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.1 ns

Propagation Delay (tpd):

15.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LVC541ADBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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