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SN74HC245DWG4

Texas Instruments

SN74HC245DWG4 by Texas Instruments

SN74HC245DWG4 by Texas Instruments is an 8-bit bus driver with 26ns propagation delay at 5V. It features a small outline package, dual terminal position, and true output polarity. Ideal for bidirectional control applications in industrial settings due to its CMOS technology and common control feature.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,420 parts In-Stock

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Digiode

USA . 1,616 parts In-Stock

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1,616

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Electronics Depot

USA . 164 parts In-Stock

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Prism Electronics

USA . 147 parts In-Stock

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Nova Conductors

Japan . 74 parts In-Stock

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Component Sense

UK . 25 parts In-Stock

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AZTECH Wire

Italy . 703 parts In-Stock

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$5.088

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703

$5.088

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Andel Nordic

Denmark . 2,948 parts In-Stock

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$6.204

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$5.956

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$5.956

2,948

$6.204

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$5.956

$5.956

Corohmni

South Africa . 532 parts In-Stock

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$9.597

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532

$9.597

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Ampacity Inc.

Singapore . 430 parts In-Stock

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$26.000

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430

$26.000

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Parana Technologies

USA . 109 parts In-Stock

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$27.429

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$35.712

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109

$27.429

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DigiPath Technology Company

USA . 2,011 parts In-Stock

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$30.203

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$27.786

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$30.203

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ChromeModa Solutions

Germany . 5,888 parts In-Stock

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$30.819

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$25.272

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

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$30.819

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$29.278

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$27.737

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$30.819

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$32.041

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$30.439

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$30.439

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$32.041

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Semicontronic

India . 751 parts In-Stock

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$40.000

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$39.000

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$38.800

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751

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One Stop Electronics

USA . 371 parts In-Stock

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$62.000

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Continental Prestige Electronics

USA . 5,314 parts In-Stock

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Corphita

USA . 3,211 parts In-Stock

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Perfect Parts

USA . 2,124 parts In-Stock

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Argo Parts USA

USA . 1,597 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock seamless data transmission with the Texas Instruments SN74HC245DWG4 Bus Driver & Transceiver. Crafted with precision and expertise by Texas Instruments, this product guarantees reliability and performance. Ideal for a wide range of applications, this versatile device offers customers value through its efficient operation, high-quality construction, and ease of use. Trust Texas Instruments to deliver exceptional results with the SN74HC245DWG4 – your go-to solution for smooth and reliable data transfer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 26 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier, saving time and effort.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of systems and devices.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, improving the overall performance and longevity of the product.

Technical Specifications

Bus Driver & Transceivers SN74HC245DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

26 ns

Propagation Delay (tpd):

170 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74HC245DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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