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SN74LVC2G126DCUT

Texas Instruments

SN74LVC2G126DCUT by Texas Instruments

SN74LVC2G126DCUT by Texas Instruments is a 2-function bus driver with a propagation delay of 4 ns and operates at a nominal voltage of 1.8V. It is designed for automotive applications, featuring a small outline package style and true output polarity.

Median Price

$0.608

Lifecycle Status

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25

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1k+

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Chip1Stop

Japan . 5 parts In-Stock

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Texas Instruments

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DigiKey

USA . 17,641 parts In-Stock

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$0.562

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Mouser Electronics

USA . 1,404 parts In-Stock

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Arrow

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$0.520

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Verical

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Avnet

USA . 250 parts In-Stock

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$0.326

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Rochester

USA . 245 parts In-Stock

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$0.642

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$0.475

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Digiode

USA . 4,977 parts In-Stock

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Nova Conductors

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Sensible Micro Corp

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TME

Poland . 1,000 parts In-Stock

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Bristol Electronics

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North Shore Components

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Touchstone Systems

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Prism Electronics

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Semicontronic

India . 55,368 parts In-Stock

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$0.446

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$0.435

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Ampacity Inc.

Singapore . 55,263 parts In-Stock

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Component Stockers USA

USA . 240,272 parts In-Stock

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Corphita

USA . 2,674 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

USA . 4,388 parts In-Stock

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Netroflash

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Microchip USA

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Andel Nordic

Denmark . 3,637 parts In-Stock

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Advanced Electronics

New Zealand . 69 parts In-Stock

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$23.699

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Parana Technologies

USA . 1,975 parts In-Stock

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ChromeModa Solutions

Germany . 2,627 parts In-Stock

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IDEA Electronic Components Group

UK . 865 parts In-Stock

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Corohmni

South Africa . 34 parts In-Stock

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DigiPath Technology Company

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Brazil . 100 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the SN74LVC2G126DCUT, a versatile Bus Driver & Transceiver perfect for a wide range of applications. With fast propagation delay and low power consumption, this product offers efficient signal transmission while maintaining high performance. Whether you're designing automotive systems or industrial equipment, this compact and durable component will provide the value and benefits you need. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 4 ns

Low propagation delay ensures fast signal transmission, making the product efficient.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient.

Load Capacitance (CL): 50 pF

Designed to handle a moderate load capacitance for reliable performance.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, suitable for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers SN74LVC2G126DCUT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

2 mm

Trade Compliance

SN74LVC2G126DCUT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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