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74LVC1T45GW-Q100H

NXP Semiconductors

74LVC1T45GW-Q100H by NXP Semiconductors

NXP Semiconductors' 74LVC1T45GW-Q100H is a CMOS bus driver with 23.5 ns propagation delay, AEC-Q100 screening, and 3-STATE output. Ideal for automotive applications due to its small outline package, -40 to 125 °C operating temperature range, and dual terminal position.

Median Price

$0.179

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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DigiKey

USA . 690 parts In-Stock

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$0.350

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$0.188

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690

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Adafruit Industries

USA . 51 parts In-Stock

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$32.134

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$30.527

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Future Electronics

Canada . 3,000 parts In-Stock

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TTI

USA . 3,000 parts In-Stock

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Chip1Stop

Japan . 1,704 parts In-Stock

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Verical

USA . 1,704 parts In-Stock

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Nova Conductors

Japan . 61 parts In-Stock

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Digiode

USA . 4,311 parts In-Stock

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TME

Poland . 974 parts In-Stock

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974

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Chip Stock

USA . 178,000 parts In-Stock

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IBS Electronics

USA . 12,000 parts In-Stock

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NAC Semi

USA . 6,000 parts In-Stock

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Vyrian

USA . 3,548 parts In-Stock

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VNN

France . 2,400 parts In-Stock

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Anansix

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Semicontronic

India . 6,252 parts In-Stock

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$0.097

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$0.095

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$0.094

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Ampacity Inc.

Singapore . 6,433 parts In-Stock

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$0.099

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AZTECH Wire

Italy . 13,936 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Continental Prestige Electronics

USA . 6,769 parts In-Stock

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Argo Parts USA

USA . 504 parts In-Stock

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Corphita

USA . 3,654 parts In-Stock

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Component Stockers USA

USA . 51,825 parts In-Stock

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Corohmni

South Africa . 224 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,070 parts In-Stock

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Advanced Electronics

New Zealand . 51 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Futuretech Components

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Perfect Parts

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UNI Independent Distributors

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Lixinc

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iodParts Technologies Inc.

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Supply Digital

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Overview

Elevate your automotive electronics with the 74LVC1T45GW-Q100H by NXP Semiconductors. This high-quality bus driver and transceiver offers reliable performance and durability, thanks to NXP's cutting-edge technology and stringent AEC-Q100 screening. Perfect for a wide range of applications, this product provides customers with seamless signal transmission and efficient power management. Experience the value and benefits of NXP's exceptional engineering in every drive with the 74LVC1T45GW-Q100H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver/transceiver.

Surface Mount: YES

Allows for easy installation and integration onto PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Meets automotive industry standards, ensuring reliability and performance in harsh operating conditions.

Nominal Supply Voltage / Vsup (V): 1.5

Optimal supply voltage for efficient operation of the bus driver/transceiver.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components and peripherals.

Propagation Delay (tpd): 23.5 ns

Fast response time allows for quick data transmission and communication.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive applications.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signal, enhancing the functionality of the device.

Minimum Operating Temperature: -40 °C

Can operate in low temperatures without compromising performance.

No. of Ports: 2

Sufficient number of ports for connecting to multiple devices or systems.

Width: 1.25 mm

Compact size allows for space-efficient design and integration into tight spaces.

Output Polarity: TRUE

Ensures correct signal polarity for seamless communication with other components.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, meeting industry requirements and standards.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Terminal Form: GULL WING

Facilitates easy soldering and connection of the bus driver/transceiver to the PCB.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high density mounting on PCBs, saving board space.

Maximum Supply Voltage (Vsup): 5.5 V

Wide range of supply voltage allows for compatibility with different power sources.

Technical Specifications

Bus Driver & Transceivers 74LVC1T45GW-Q100H attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

23.5 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

74LVC1T45GW-Q100H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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