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74LVC1G125GV

NXP Semiconductors

74LVC1G125GV by NXP Semiconductors

NXP Semiconductors' 74LVC1G125GV is a CMOS bus driver with 6 ns propagation delay, suitable for automotive applications. It operates at a nominal voltage of 3.3 V and has a load capacitance of 50 pF. The device features a small outline package with dual terminals and enables low control type.

Median Price

$15.594

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Adafruit Industries

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Verical

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Digiode

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Aztec Data Supply Inc.

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Overview

Enhance your electronic designs with the reliable 74LVC1G125GV by NXP Semiconductors. Crafted with precision and expertise, this bus driver & transceiver offers seamless performance in a compact package. Ideal for automotive applications, this versatile component provides a true output polarity and a fast propagation delay, ensuring efficient signal transmission. Trust NXP Semiconductors to deliver cutting-edge technology that meets your design needs, providing value and quality in every component. Elevate your projects with the 74LVC1G125GV and experience the difference of superior semiconductor solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for automotive applications where weight is a concern.

Propagation Delay At Nominal Supply: 6 ns

The low propagation delay ensures fast signal transmission, making this product ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common 3.3V supply voltage simplifies compatibility with other components in the circuit.

Load Capacitance (CL): 50 pF

Having a moderate load capacitance ensures stability in signal transmission and reception, contributing to reliable communication.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive use.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers 74LVC1G125GV attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

74LVC1G125GV Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-628-1206, 5962016281206

NIIN

016281206

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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