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SN74HCT573DWRG4

Texas Instruments

SN74HCT573DWRG4 by Texas Instruments

SN74HCT573DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 44ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring true output polarity control and low enable type.

Median Price

$1.770

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,266 parts In-Stock

1+ parts

$1.770

100+ parts

$0.685

1k+ parts

$0.467

10k+ parts

$0.310

1,266

$1.770

$0.685

$0.467

$0.310

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 32,080 parts In-Stock

1+ parts

-

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32,080

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Vyrian

USA . 3,385 parts In-Stock

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3,385

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Digiode

USA . 2,944 parts In-Stock

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2,944

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Bristol Electronics

USA . 830 parts In-Stock

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830

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Ashlea Components Ltd

UK . 230 parts In-Stock

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230

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Distributors (Availability)

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Andel Nordic

Denmark . 719 parts In-Stock

1+ parts

$6.872

100+ parts

-

1k+ parts

$6.597

10k+ parts

$6.597

719

$6.872

-

$6.597

$6.597

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$13.491

100+ parts

$12.816

1k+ parts

$12.816

10k+ parts

-

3,000

$13.491

$12.816

$12.816

-

Parana Technologies

USA . 1,221 parts In-Stock

1+ parts

$14.594

100+ parts

-

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$15.033

10k+ parts

-

1,221

$14.594

-

$15.033

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ChromeModa Solutions

Germany . 5,389 parts In-Stock

1+ parts

$16.398

100+ parts

$13.446

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5,389

$16.398

$13.446

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IDEA Electronic Components Group

UK . 2,212 parts In-Stock

1+ parts

$16.398

100+ parts

$15.578

1k+ parts

$14.758

10k+ parts

-

2,212

$16.398

$15.578

$14.758

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AZTECH Wire

Italy . 238 parts In-Stock

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$17.020

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238

$17.020

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Corohmni

South Africa . 634 parts In-Stock

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$31.104

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634

$31.104

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One Stop Electronics

USA . 1,126 parts In-Stock

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$48.000

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$48.000

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Ampacity Inc.

Singapore . 307 parts In-Stock

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$55.000

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307

$55.000

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Semicontronic

India . 196 parts In-Stock

1+ parts

$57.000

100+ parts

$55.575

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$55.290

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196

$57.000

$55.575

$55.290

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Microchip USA

USA . 2,356 parts In-Stock

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2,356

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DigiPath Technology Company

USA . 1,857 parts In-Stock

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$14.784

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1,857

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$14.784

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Argo Parts USA

USA . 1,498 parts In-Stock

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1,498

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 605 parts In-Stock

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605

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Continental Prestige Electronics

USA . 555 parts In-Stock

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555

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your electronic projects with the SN74HCT573DWRG4 by Texas Instruments, a top-of-the-line bus driver & transceiver that guarantees seamless data transmission. Crafted with precision and expertise by Texas Instruments, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this 8-bit transceiver boasts a fast propagation delay and 3-state output characteristics, making it a versatile choice for any project. Experience the value and benefits of this small outline package, designed to meet industrial-grade standards while delivering exceptional performance. Upgrade your projects today with the SN74HCT573DWRG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver, ensuring longevity and reliability.

Propagation Delay At Nominal Supply: 44 ns

Fast propagation delay allows for quick data transmission, making this bus driver efficient in communication protocols.

Surface Mount: YES

Surface mount capability makes it easy to integrate this bus driver into a circuit board, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with many systems and power supplies.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing the risk of errors in data communication.

Technical Specifications

Bus Driver & Transceivers SN74HCT573DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

65 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74HCT573DWRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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