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USB1T11AMTCX

Onsemi

USB1T11AMTCX by Onsemi

USB1T11AMTCX by Onsemi is a 14-terminal bus driver with 300ns propagation delay, operating b/w -40 to 85°C. It features a 3.3V nominal voltage and supports industrial applications requiring true output polarity in a compact, surface-mount package.

Median Price

$0.770

Lifecycle Status

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In-Stock Inventory

1k+

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Arrow

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TME

Poland . 86 parts In-Stock

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$0.540

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Vyrian

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Digiode

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Martec Srl

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Bristol Electronics

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Innovative Industries

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LWI Electronics Inc

India . 1,400 parts In-Stock

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Cyclops Electronics Ltd

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Nova Conductors

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Chip Stock

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ComSIT Distribution GmbH

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Semi Source

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Prism Electronics

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Aztec Data Supply Inc.

USA . 50 parts In-Stock

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$0.464

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Corohmni

South Africa . 297 parts In-Stock

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Component Stockers USA

USA . 55 parts In-Stock

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Vigor

Singapore . 1,073 parts In-Stock

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Semicontronic

India . 2,254 parts In-Stock

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$48.750

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Ampacity Inc.

Singapore . 2,038 parts In-Stock

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Perfect Parts

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Problanco Electronics

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Corphita

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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UHIMA Technologies

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Overview

Experience seamless data transfer and reliable communication with the USB1T11AMTCX by Onsemi. As a trusted manufacturer in the industry, Onsemi ensures top-notch quality and performance for all their products. The USB1T11AMTCX falls under the Bus Driver & Transceivers category, making it an essential component for various applications. With its compact design and advanced features, this product offers unparalleled value to customers looking for efficient and effective solutions. Upgrade your system with the USB1T11AMTCX and enjoy the benefits of smooth data transmission and enhanced connectivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the bus driver & transceiver.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures consistent performance of the device.

Propagation Delay (tpd): 300 ns

Low propagation delay of 300ns allows for quick signal transmission and response times.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable operation in harsh environments.

Output Characteristics: 3-STATE

3-STATE output characteristics provide flexibility in controlling the signal output.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the device can withstand rugged operating conditions.

Technical Specifications

Bus Driver & Transceivers USB1T11AMTCX attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

USB

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

USB1T11AMTCX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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