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MC74HC125ADG

Onsemi

MC74HC125ADG by Onsemi

MC74HC125ADG by Onsemi is a 4-function bus driver with 27ns propagation delay at 5V. It has a 135ns propagation delay, operates b/w -55 to 125 °C, and supports up to 6A output current. Ideal for applications requiring fast signal transmission in compact spaces.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 71,969 parts In-Stock

1+ parts

$0.229

100+ parts

$0.216

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$0.195

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71,969

$0.229

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Adafruit Industries

USA . 10 parts In-Stock

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$0.232

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$0.220

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10

$0.232

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Arrow

USA . 678 parts In-Stock

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$0.307

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$0.200

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$0.171

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678

$0.307

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Farnell

UK . 648 parts In-Stock

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$0.215

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$0.173

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$0.165

648

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$0.215

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$0.165

Mouser Electronics

USA . 12,915 parts In-Stock

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$0.420

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$0.178

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Newark

USA . 648 parts In-Stock

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$0.571

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$0.292

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$0.241

648

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Element14

Singapore . 1,511 parts In-Stock

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$0.675

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$0.426

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$0.281

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1,511

$0.675

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Verical

USA . 44,055 parts In-Stock

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Master Electronics

USA . 1,925 parts In-Stock

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$0.141

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$0.130

1,925

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Avnet

USA . 1,870 parts In-Stock

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DigiKey

USA . 1,844 parts In-Stock

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Chip1Stop

Japan . 678 parts In-Stock

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$0.197

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$0.145

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$0.132

678

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$0.132

EBV Elektronik

Germany . 55 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,634 parts In-Stock

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$0.156

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$0.156

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Nova Conductors

Japan . 500 parts In-Stock

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$0.250

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500

$0.250

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TME

Poland . 143 parts In-Stock

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$0.747

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$0.299

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$0.235

143

$0.747

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$0.299

$0.235

Flip Electronics

USA . 30,030 parts In-Stock

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Chip Stock

USA . 23,400 parts In-Stock

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Vyrian

USA . 10,844 parts In-Stock

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EPE Components Inc.

USA . 6,022 parts In-Stock

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Bristol Electronics

USA . 5,042 parts In-Stock

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IBS Electronics

USA . 1,955 parts In-Stock

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$0.147

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$0.147

DigiKey Marketplace

USA . 1,844 parts In-Stock

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$0.200

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NAC Semi

USA . 1,485 parts In-Stock

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$0.262

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$0.244

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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EMSNET

USA . 695 parts In-Stock

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695

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Prism Electronics

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530

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Extreme Components

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GSS - Global Semi Support

USA . 250 parts In-Stock

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Sunrise Surplus Inc.

USA . 144 parts In-Stock

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Euro-Tech

UK . 125 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 11,778 parts In-Stock

1+ parts

$0.139

100+ parts

$0.136

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$0.135

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11,778

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$0.135

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Ampacity Inc.

Singapore . 11,491 parts In-Stock

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$0.139

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Corphita

USA . 1,404 parts In-Stock

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$0.148

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Corohmni

South Africa . 257 parts In-Stock

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$0.164

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257

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$0.232

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$0.220

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10

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Argo Parts USA

USA . 1,859 parts In-Stock

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$0.247

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$0.240

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Continental Prestige Electronics

USA . 1,541 parts In-Stock

1+ parts

$0.416

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$0.352

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$0.227

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$0.193

1,541

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$0.193

Aztec Data Supply Inc.

USA . 2,173 parts In-Stock

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$14.276

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Perfect Parts

USA . 21,457 parts In-Stock

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Kulean Microsystems

USA . 8,386 parts In-Stock

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Lixinc

USA . 7,122 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Eastek

USA . 1,870 parts In-Stock

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GreenTree Electronics

Israel . 1,870 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,821 parts In-Stock

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SupplyDigital Components

Austria . 1,802 parts In-Stock

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Problanco Electronics

Mexico . 1,566 parts In-Stock

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TANS Electronics

Latvia . 511 parts In-Stock

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511

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Cyclops Electronics Ltd (Excess)

UK . 60 parts In-Stock

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UHIMA Technologies

Türkiye . 35 parts In-Stock

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Overview

Experience top-notch performance with the MC74HC125ADG by Onsemi, a leading manufacturer in the industry. This bus driver and transceiver category product offers unmatched quality and reliability for your applications. With a nominal supply voltage of 5V and a propagation delay of just 27ns, this small outline package delivers exceptional value and efficiency. Whether you're looking for true output polarity or 3-state output characteristics, the MC74HC125ADG is the perfect choice for your project needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 27 ns

With a low propagation delay, this product can quickly transmit signals, making it suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes installation easier and more streamlined, saving time and effort during assembly.

No. of Functions: 4

Having multiple functions in one device increases efficiency and saves space in the circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard voltage requirements in many applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable operation in various load conditions.

Power Supplies (V): 2/6

Support for power supplies ranging from 2V to 6V provides flexibility in power source options for different system requirements.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and integration with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact and portable devices.

Maximum I (ol): 6 Amp

With a maximum output current of 6A, this product can drive high-current loads efficiently.

Technical Specifications

Bus Driver & Transceivers MC74HC125ADG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC125ADG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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