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SN74AVC1T45DCKTE4

Texas Instruments

SN74AVC1T45DCKTE4 by Texas Instruments

SN74AVC1T45DCKTE4 by Texas Instruments is a bus driver & transceiver with 5.6 ns propagation delay at 1.5V, suitable for bidirectional applications. It operates at a max temperature of 85°C, supports translation b/w 1.5/3.3V power supplies, and features a small outline package style for compact designs.

Median Price

$28.599

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$28.599

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10

$28.599

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Vyrian

USA . 6,082 parts In-Stock

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Digiode

USA . 1,083 parts In-Stock

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1,083

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Distributors (Availability)

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Andel Nordic

Denmark . 5,787 parts In-Stock

1+ parts

$2.244

100+ parts

-

1k+ parts

$2.154

10k+ parts

$2.154

5,787

$2.244

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$2.154

$2.154

Ampacity Inc.

Singapore . 1,134 parts In-Stock

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$5.000

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$5.000

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AZTECH Wire

Italy . 861 parts In-Stock

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$11.389

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861

$11.389

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Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$21.236

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$20.174

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$20.174

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750

$21.236

$20.174

$20.174

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Parana Technologies

USA . 1,766 parts In-Stock

1+ parts

$21.829

100+ parts

-

1k+ parts

$22.313

10k+ parts

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1,766

$21.829

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$22.313

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ChromeModa Solutions

Germany . 3,605 parts In-Stock

1+ parts

$24.527

100+ parts

$20.112

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3,605

$24.527

$20.112

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IDEA Electronic Components Group

UK . 774 parts In-Stock

1+ parts

$24.527

100+ parts

$23.301

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$22.074

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774

$24.527

$23.301

$22.074

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Corohmni

South Africa . 12 parts In-Stock

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$33.721

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$33.721

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One Stop Electronics

USA . 222 parts In-Stock

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$39.000

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222

$39.000

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Semicontronic

India . 565 parts In-Stock

1+ parts

$48.000

100+ parts

$46.800

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$46.560

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565

$48.000

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$46.560

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Continental Prestige Electronics

USA . 6,230 parts In-Stock

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Argo Parts USA

USA . 2,601 parts In-Stock

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DigiPath Technology Company

USA . 2,179 parts In-Stock

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$22.114

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2,179

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Corphita

USA . 1,063 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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Bastille Electronics

Australia . 21 parts In-Stock

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Overview

Enhance your electronic designs with the SN74AVC1T45DCKTE4 by Texas Instruments, a high-quality bus driver & transceiver that offers seamless voltage translation capabilities. With its compact package body material and excellent performance in various applications, this product ensures reliable signal transmission while maintaining low power consumption. Its 3-state output characteristics and bidirectional control make it versatile for a wide range of industrial uses. Trust Texas Instruments for cutting-edge technology and unparalleled value in every component.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making it suitable for rugged environments.

Propagation Delay At Nominal Supply

5.6 ns - The fast propagation delay ensures quick data transmission, ideal for high-speed communication applications.

Surface Mount

YES - The surface-mount feature allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Package Shape

RECTANGULAR - The compact rectangular shape makes it easy to integrate into various designs and layouts.

Translation 1.5/3.3V&1.5/3.3V

This dual voltage translation capability allows for compatibility with different systems and devices, enhancing versatility.

Nominal Supply Voltage / Vsup (V)

1.5 - The low nominal supply voltage reduces power consumption, making it energy-efficient.

Power Supplies (V)

1.5/3.3 - The multiple power supply options provide flexibility in power management and compatibility with various systems.

No. of Terminals

6 - The sufficient number of terminals allows for easy connection and integration into different circuit configurations.

Package Style (Meter)

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - The compact package style saves space and ensures compatibility with standard PCB designs.

Maximum I (ol)

8 Amp - The high maximum output current capability allows for driving a wide range of load devices.

Propagation Delay (tpd)

5.6 ns - The low propagation delay ensures minimal signal delay, critical for time-sensitive applications.

Maximum Operating Temperature

85 °C - The high maximum operating temperature range ensures reliability in harsh environmental conditions.

Output Characteristics

3-STATE - The 3-state output feature enables tri-state bus control, allowing for efficient bus sharing and communication.

Minimum Operating Temperature

40 °C - The low minimum operating temperature range ensures functionality in extreme cold conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - The high-quality terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position

DUAL - The dual terminal position offers flexibility in orientation and installation, accommodating different PCB layouts.

No. of Ports

2 - The multiple ports provide connectivity options for different devices and systems, enhancing flexibility in data transmission.

Maximum Seated Height

1.1 mm - The low seated height allows for compact designs and efficient use of space on PCBs.

Width

1.25 mm - The narrow width makes it suitable for applications with limited space constraints.

Output Polarity

TRUE - The true output polarity ensures accurate signal transmission without distortion or inversion.

Minimum Supply Voltage (Vsup)

1.2 V - The low minimum supply voltage requirement allows for operation in low-power environments.

Maximum Time At Peak Reflow Temperature (s)

30 - The maximum reflow time ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C

260 - The high peak reflow temperature capability provides durability and stability during soldering processes.

Length

2 mm - The compact length allows for easy integration into tight spaces and layouts.

Temperature Grade

INDUSTRIAL - The industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology

CMOS - The CMOS technology offers low power consumption and high noise immunity, ideal for high-performance applications.

Terminal Form

GULL WING - The gull-wing terminal form ensures secure connections and easy soldering during assembly.

Packing Method

TR - The tape and reel packing method simplifies handling and storage, making it suitable for automated assembly processes.

Terminal Pitch

0.65 mm - The narrow terminal pitch allows for high-density PCB designs and efficient use of space.

Count Direction

BIDIRECTIONAL - The bidirectional count direction capability enables seamless data exchange in both directions, enhancing communication flexibility.

Control Type

COMMON CONTROL - The common control feature simplifies system integration and management, enhancing overall functionality and operation.

Maximum Supply Voltage (Vsup)

3.6 V - The high maximum supply voltage tolerance ensures compatibility with a wide range of systems and devices.

Technical Specifications

Bus Driver & Transceivers SN74AVC1T45DCKTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER SUPPLY RAILS FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Propagation Delay At Nominal Supply:

5.6 ns

Propagation Delay (tpd):

5.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

1.25 mm

Trade Compliance

SN74AVC1T45DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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