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SN74HCT541NSRE4

Texas Instruments

SN74HCT541NSRE4 by Texas Instruments

SN74HCT541NSRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 29 ns at 5V. It features a 3-STATE output and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring true output polarity control, such as data communication systems.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,330 parts In-Stock

1+ parts

$1.950

100+ parts

$0.755

1k+ parts

$0.515

10k+ parts

$0.342

1,330

$1.950

$0.755

$0.515

$0.342

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.338

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$0.338

-

-

-

Digiode

USA . 642 parts In-Stock

1+ parts

$0.817

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$0.817

-

-

-

Vyrian

USA . 1,519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,519

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,328 parts In-Stock

1+ parts

$0.338

100+ parts

-

1k+ parts

-

10k+ parts

$0.331

5,328

$0.338

-

-

$0.331

Argo Parts USA

USA . 508 parts In-Stock

1+ parts

$0.338

100+ parts

-

1k+ parts

-

10k+ parts

$0.328

508

$0.338

-

-

$0.328

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.345

100+ parts

$0.345

1k+ parts

$0.345

10k+ parts

-

100

$0.345

$0.345

$0.345

-

Corphita

USA . 2,333 parts In-Stock

1+ parts

$0.774

100+ parts

-

1k+ parts

-

10k+ parts

-

2,333

$0.774

-

-

-

Ampacity Inc.

Singapore . 1,538 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1,538

$1.330

-

-

-

Semicontronic

India . 1,518 parts In-Stock

1+ parts

$1.330

100+ parts

$1.297

1k+ parts

$1.290

10k+ parts

-

1,518

$1.330

$1.297

$1.290

-

Andel Nordic

Denmark . 265 parts In-Stock

1+ parts

$2.528

100+ parts

-

1k+ parts

$2.427

10k+ parts

$2.427

265

$2.528

-

$2.427

$2.427

Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

$25.002

100+ parts

-

1k+ parts

$25.694

10k+ parts

-

2,033

$25.002

-

$25.694

-

ChromeModa Solutions

Germany . 4,123 parts In-Stock

1+ parts

$28.092

100+ parts

$23.035

1k+ parts

-

10k+ parts

-

4,123

$28.092

$23.035

-

-

IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$28.092

100+ parts

$26.687

1k+ parts

$25.283

10k+ parts

-

788

$28.092

$26.687

$25.283

-

Corohmni

South Africa . 1,020 parts In-Stock

1+ parts

$29.006

100+ parts

-

1k+ parts

-

10k+ parts

-

1,020

$29.006

-

-

-

Microchip USA

USA . 2,504 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

2,504

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.331

1k+ parts

$0.321

10k+ parts

$0.314

1,000

-

$0.331

$0.321

$0.314

DigiPath Technology Company

USA . 699 parts In-Stock

1+ parts

-

100+ parts

$25.328

1k+ parts

-

10k+ parts

-

699

-

$25.328

-

-

Overview

Unlock seamless communication and reliable data transfer with the SN74HCT541NSRE4 by Texas Instruments. Crafted with precision using high-quality materials, this bus driver and transceiver offers unparalleled performance and durability. Perfect for a wide range of applications, this product ensures fast propagation delay and 3-STATE output characteristics. With a nominal supply voltage of 5V and a compact design, the SN74HCT541NSRE4 provides exceptional value and efficiency, making it the ideal choice for your electronic projects. Trust Texas Instruments for superior quality and innovation in every component.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and light weight, making it a reliable choice for bus driver applications.

Propagation Delay At Nominal Supply

29 ns - Fast propagation delay ensures efficient data transmission in bus driver systems.

Surface Mount

YES - Easy installation and space-saving design for convenient integration into circuit boards.

Package Shape

RECTANGULAR - Compact design allows for efficient use of space in electronic systems.

No. of Bits

8 - Ideal for handling multiple bits of data in bus driver applications.

Nominal Supply Voltage / Vsup (V)

5 - Compatible with standard 5V power supplies for easy integration into existing systems.

Load Capacitance (CL)

150 pF - Suitable for driving loads with capacitive characteristics, ensuring stability in operation.

Power Supplies (V)

5 - Matches the nominal supply voltage for seamless compatibility with power sources.

No. of Terminals

20 - Sufficient terminals for connecting various input and output devices in bus driver systems.

Package Style (Meter)

SMALL OUTLINE - Streamlined and compact package style for efficient circuit board layout.

Maximum I (ol)

6 Amp - Capable of driving high current loads, making it versatile for different applications.

Propagation Delay (tpd)

42 ns - Fast propagation delay ensures quick data transmission and response times in bus driver systems.

Maximum Operating Temperature

85 °C - Wide operating temperature range for reliable performance in varying conditions.

Output Characteristics

3-STATE - 3-state output enables flexible control over the bus driver outputs.

Minimum Operating Temperature

40 °C - Able to withstand low temperatures, making it suitable for harsh environments.

Terminal Finish

Nickel/Palladium/Gold (Ni/Pd/Au) - Corrosion-resistant terminal finish for long-lasting reliability.

Terminal Position

DUAL - Dual terminal position for better connectivity options in bus driver applications.

No. of Ports

2 - Two ports for connecting multiple devices and routing data efficiently in bus driver systems.

Maximum Seated Height

2 mm - Low profile design for space-saving installation in compact electronic systems.

Width

5.3 mm - Narrow width for flexibility in layout and placement on circuit boards.

Output Polarity

TRUE - True output polarity for accurate signal transmission in bus driver applications.

Technical Specifications

Bus Driver & Transceivers SN74HCT541NSRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Load Capacitance (CL):

150 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74HCT541NSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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