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74HCT1G125GW

NXP Semiconductors

74HCT1G125GW by NXP Semiconductors

NXP Semiconductors' 74HCT1G125GW is a CMOS bus driver with 36ns propagation delay at 5V. It features 3-STATE output and can handle up to 6A current. Ideal for automotive applications due to its thin profile, small outline package and dual terminal position.

Median Price

$0.076

Lifecycle Status

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22

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1k+

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UK . 6,000 parts In-Stock

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Nova Conductors

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LIBRA Elektronik GmbH

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PC Components Company LLC

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Atlantic Semiconductor

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Semicontronic

India . 5,725 parts In-Stock

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Ampacity Inc.

Singapore . 5,678 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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AZTECH Wire

Italy . 6,524 parts In-Stock

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Andel Nordic

Denmark . 3,711 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Overview

Discover the cutting-edge 74HCT1G125GW by NXP Semiconductors, a top-tier Bus Driver & Transceiver that delivers unparalleled quality and reliability. With a compact design and advanced CMOS technology, this innovative component ensures fast and efficient signal transmission for a wide range of applications. From automotive to industrial systems, customers can trust in the superior performance and precision of this product. Elevate your projects with the value and benefits that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for long-term use in various conditions.

Nominal Supply Voltage / Vsup (V): 5

This product operates at a standard 5V supply voltage, making it compatible with most common electronic systems and easy to integrate into existing setups.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extended periods of use without overheating or malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable for data transmission in various applications.

Control Type: ENABLE LOW

The enable low control type allows for easy activation and deactivation of the device, providing flexibility and convenience in managing the operation of the bus driver and transceiver.

Technical Specifications

Bus Driver & Transceivers 74HCT1G125GW attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

HCT

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.05 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

36 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74HCT1G125GW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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