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MC74HC573ADWG

Onsemi

MC74HC573ADWG by Onsemi

MC74HC573ADWG by Onsemi is an 8-bit bus driver with 45ns propagation delay. It operates at a supply voltage of 3V, suitable for applications requiring true output polarity and 3-STATE output characteristics. This CMOS technology device comes in a small outline package, making it ideal for military-grade temperature environments.

Median Price

$0.478

Lifecycle Status

Suppliers In-Stock

22

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1k+

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Mouser Electronics

USA . 778 parts In-Stock

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Rochester

USA . 16,696 parts In-Stock

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$0.469

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$0.389

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$0.347

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DigiKey

USA . 16,696 parts In-Stock

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$0.590

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Verical

USA . 8,853 parts In-Stock

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Arrow

USA . 798 parts In-Stock

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Future Electronics

Canada . 657 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,114 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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TME

Poland . 14 parts In-Stock

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$0.700

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Component Electronics Inc.

Canada . 68 parts In-Stock

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$0.750

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Flip Electronics

USA . 41,666 parts In-Stock

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Sensible Micro Corp

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Vyrian

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ComSIT Distribution GmbH

Germany . 1,748 parts In-Stock

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IBS Electronics

USA . 657 parts In-Stock

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$0.337

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NAC Semi

USA . 532 parts In-Stock

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Goldney Electronics S.L.

Spain . 176 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

USA . 104 parts In-Stock

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North Shore Components

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Component Sense

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Semicontronic

India . 4,378 parts In-Stock

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Ampacity Inc.

Singapore . 4,089 parts In-Stock

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Corphita

USA . 393 parts In-Stock

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Argo Parts USA

USA . 2,215 parts In-Stock

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Continental Prestige Electronics

USA . 409 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Corohmni

South Africa . 326 parts In-Stock

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Advanced Electronics

New Zealand . 20 parts In-Stock

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Aztec Data Supply Inc.

USA . 148 parts In-Stock

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Perfect Parts

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Kulean Microsystems

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Eastek

USA . 4,598 parts In-Stock

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GreenTree Electronics

Israel . 4,598 parts In-Stock

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SupplyDigital Components

Austria . 4,179 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

Türkiye . 935 parts In-Stock

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TANS Electronics

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Overview

Unlock seamless data transfer with the MC74HC573ADWG by Onsemi, a top-tier bus driver & transceiver that promises reliable performance. Onsemi's reputation for superior quality shines through in this product, offering customers unmatched value and benefits. Ideal for a wide range of applications, this 8-bit device boasts a low propagation delay of 45 ns, making it a powerful and efficient choice for your projects. Say goodbye to lagging signals and hello to smooth, fast data transmission with the MC74HC573ADWG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product suitable for rugged environments.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures quick signal transmission, making the product efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, ensuring compatibility with most systems.

Power Supplies (V): 2/6

Support for multiple power supply voltages provides flexibility in system design and compatibility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to function reliably in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Technical Specifications

Bus Driver & Transceivers MC74HC573ADWG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC74HC573ADWG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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